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MA4P504-4T

Description
Pin Diode, 500V V(BR), Silicon, ROHS COMPLIANT, HERMETIC SEALED, GLASS, CASE 4, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size445KB,6 Pages
ManufacturerMACOM
Websitehttp://www.macom.com
Environmental Compliance  
Download Datasheet Parametric View All

MA4P504-4T Overview

Pin Diode, 500V V(BR), Silicon, ROHS COMPLIANT, HERMETIC SEALED, GLASS, CASE 4, 2 PIN

MA4P504-4T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMACOM
package instructionO-LALF-W2
Contacts2
Manufacturer packaging codeCASE 4
Reach Compliance Codecompliant
ECCN codeEAR99
applicationATTENUATOR; SWITCHING
Minimum breakdown voltage500 V
Shell connectionISOLATED
ConfigurationSINGLE
Maximum diode capacitance0.35 pF
Diode component materialsSILICON
Maximum diode forward resistance0.6 Ω
Diode resistance test current100 mA
Diode resistance test frequency100 MHz
Diode typePIN DIODE
frequency bandHIGH FREQUENCY TO S BAND
JESD-30 codeO-LALF-W2
Minority carrier nominal lifetime1 µs
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum power dissipation1 W
Certification statusNot Qualified
surface mountNO
technologyPOSITIVE-INTRINSIC-NEGATIVE
Terminal formWIRE
Terminal locationAXIAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Axial Leaded Glass PIN Diodes
Multi Purpose Axial Leaded Glass PIN Diodes
Features
Glass Hermetically Sealed Packages
Large Signal Switch Design
Available in Low Capacitance
Passivated Chip for Low Leakage Current
Tape and Reel Packaging Available
Fully RoHS Compliant
MIL-STD 19500 Screening Available
V6
Glass Package Styles
ODS 4, 54 , 139, 146
Description
M/A-COM Technology Solutions series of low and
medium power glass PIN diodes are specifically
designed for use in switches, duplexers, electrically
tuned digital filters AGC attenuators, TR switches
and RF modulators. They preform particularly well in
distortion sensitive environments from HF through
S-Band. These hermetically sealed axial leaded PIN
diodes are designed for use in the harshest
commercial and military applications where their
inherent ruggedness makes them an ideal choice.
They may ordered screened to meet MIL-STD 19500
requirements.
PIN Chip
Glass Cylinder
Tin Plated Dumet Leads
Absolute Maximum Ratings
T
AMB
= +25°C
(Unless Otherwise Noted)
1
Parameter
D.C. Reverse Voltage
Operating Temperature
Storage Temperature
Installation Temperature
Absolute Maximum
(See Tables)
-55°C to +175°C
-55°C to +200°C
+280°C for 10 Seconds
Design Recommendations
The axial leaded, glass, PIN diode series is available
in four glass package styles. The ODS 54 is the
most suitable to meet low power, low capacitance
requirements for high isolation in a series connected
switch at VHF frequencies. The ODS 4, 139 and 146
are most suited for moderate power applications
requiring low package inductance.
Power Dissipation Listed Below Will De-Rate
Linearly to 0mW at 175˚C
Case Style 54
Case Style 139
Case Style 4 & 146
250mW without heatsink
500mW without heatsink
1000mW without heatsink
Notes
1. Operation of this device above any one of these
parameters may cause permanent damage.
1
M/A-COM Technology Solutions silicon PIN
diode chips are also available in a wide variety
of alternative package styles besides glass. For
case style options, availability and electrical
specifications, please refer to the “Packaged
PIN Diode Datasheet” located on the M/A-COM
Technology Solutions website at :
www.macomtech.com/DataSheets/packagedpindiodes.pdf
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
India
Tel: +91.80.43537383
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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