Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
MC68306
Integrated EC000 Processor
User’s Manual
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PREFACE
The complete documentation package for the MC68306 consists of the MC68306UM/AD,
MC68306 EC000 Integrated Processor User’s Manual
, M68000PM/AD,
MC68000 Family
Programmer’s Reference Manual,
and the MC68306P/D,
MC68306 EC000 Integrated
Processor Product Brief
.
The
MC68306 EC000 Integrated Processor User’s Manual
describes the programming,
capabilities, registers, and operation of the MC68306; the
MC68000 Family Programmer’s
Reference Manual
provides instruction details for the MC68306; and the
MC68306 EC000
Integrated Processor Product Brief
provides a brief description of the MC68306
capabilities.
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This user’s manual is organized as follows:
Section 1
Section 2
Section 3
Section 4
Section 5
Section 6
Section 7
Section 8
Section 9
Introduction
Signal Descriptions
68000 Bus Operation Description
EC000 Core Processor
System Operation
Serial Module
IEEE 1149.1 Test Access Port
Electrical Specifications
Ordering Information and Mechanical Data
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TABLE OF CONTENTS
Paragraph
Number
Title
Section 1
Introduction
Page
Number
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1.1 MC68EC000 Core processor.................................................................................. 1-2
1.2 On-Chip Peripherals ............................................................................................... 1-3
1.2.1 Serial Module ....................................................................................................... 1-3
1.2.2 DRAM Controller .................................................................................................. 1-4
1.2.3 Chip Selects......................................................................................................... 1-4
1.2.4 Parallel Ports........................................................................................................ 1-4
1.2.5 Interrupt Controller ............................................................................................... 1-4
1.2.6 Clock .................................................................................................................... 1-5
1.2.7 Bus Timeout Monitor ............................................................................................ 1-5
1.2.8 Mode Controller ................................................................................................... 1-5
1.2.9 IEEE 1149.1 Test................................................................................................. 1-5
Section 2
Signal Descriptions
2.1 Bus Signals ............................................................................................................. 2-5
2.1.1 Address Bus (A23–A1) ........................................................................................ 2-5
2.1.2 Address Strobe (AS) ............................................................................................ 2-5
2.1.3 Bus Error (BERR ) ................................................................................................ 2-5
2.1.4 Bus Request (BR) ................................................................................................ 2-5
2.1.5 Bus Grant (BG ) .................................................................................................... 2-6
2.1.6 Bus Grant Acknowledge (BGACK) ....................................................................... 2-6
2.1.7 Data Bus (D15–D0) ............................................................................................. 2-6
2.1.8 Data Transfer Acknowledge (DTACK) ................................................................. 2-6
2.1.9 DRAM Multiplexed Address Bus (DRAMA14 –DRAMA0) ..................................... 2-6
2.1.10 Processor Function Codes (FC2–FC0).............................................................. 2-6
2.1.11 Halt (HALT) ........................................................................................................ 2-7
2.1.12 Read/Write (R/W) ............................................................................................... 2-7
2.1.13 Upper And Lower Data Strobes (UDS ,
LDS
) ..................................................... 2-7
2.1.14 Upper Byte Write (UW ) ...................................................................................... 2-8
2.1.15 Lower Byte Write (LW )....................................................................................... 2-8
2.1.16 Output Enable (OE) ........................................................................................... 2-8
2.1.17 Reset (RESET ) .................................................................................................. 2-8
2.2 Chip Select Signals................................................................................................. 2-9
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MC68306 USER'S MANUAL
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TABLE OF CONTENTS (Continued)
Paragraph
Number
Title
Page
Number
2.3 DRAM Controller Signals........................................................................................ 2-9
2.3.1 Column Address Strobe (CAS1–
CAS0
)............................................................... 2-9
2.3.2 Row Address Strobe (RAS1 –RAS0) .................................................................... 2-9
2.3.3 DRAM Write Signal (DRAMW) ............................................................................. 2-9
2.4 Interrupt Control and Parallel Port Signals ............................................................. 2-9
2.4.1 Interrupt Request (IRQ7–IRQ1) ........................................................................... 2-9
2.4.2 Interrupt Acknowledge (IACK7–IACK1) ............................................................... 2-9
2.4.3 Port A Signals (PA7–PA0) ................................................................................... 2-9
2.4.4 Port B (PB7–PB0) ................................................................................................ 2-9
2.5 Clock and Mode Control Signals ............................................................................ 2-10
2.5.1 Crystal Oscillator (EXTAL, XTAL) ........................................................................ 2-10
2.5.2 Clock Out (CLKOUT) ........................................................................................... 2-10
2.5.3 Address Mode (AMODE) ..................................................................................... 2-10
2.6 Serial Module Signals ............................................................................................. 2-10
2.6.1 Channel A Receiver Serial-Data Input (RxDA) .................................................... 2-10
2.6.2 Channel A Transmitter Serial-Data Output (TxDA) ............................................. 2-10
2.6.3 Channel B Receiver Serial-Data Input (RxDB) .................................................... 2-10
2.6.4 Channel B Transmitter Serial-Data Output (TxDB) ............................................. 2-10
2.6.5 CTSA ................................................................................................................... 2-11
2.6.6 RTSA ................................................................................................................... 2-11
2.6.7 CTSB ................................................................................................................... 2-11
2.6.8 RTSB ................................................................................................................... 2-11
2.6.9 Crystal Oscillator (X1, X2) ................................................................................... 2-11
2.6.10 IP2 ..................................................................................................................... 2-11
2.6.11 OP3 ................................................................................................................... 2-11
2.7 JTAG Port Test Signals .......................................................................................... 2-11
2.7.1 Test Clock (TCK) ................................................................................................. 2-12
2.7.2 Test Mode Select (TMS)...................................................................................... 2-12
2.7.3 Test Data In (TDI) ................................................................................................ 2-12
2.7.4 Test Data Out (TDO) ........................................................................................... 2-12
2.7.5 Test Reset (TRST) .............................................................................................. 2-12
Section 3
68000 Bus Operation Description
3.1 Data Transfer Operations ....................................................................................... 3-1
3.1.1 Read Cycle .......................................................................................................... 3-1
3.1.2 Write Cycle .......................................................................................................... 3-4
3.1.3 Read-Modify-Write Cycle..................................................................................... 3-7
3.1.4 CPU Space Cycle ................................................................................................ 3-11
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MC68306 USER'S MANUAL
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