EMCL12N2H-124.400M datasheet, PDF

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EMCL12N2H-124.400M: DescriptionCRYSTAL OSCILLATOR, CLOCK, 124.4MHz, LVPECL OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN; CategoryPassive components oscillator; File Size205KB，5 Pages; ManufacturerECLIPTEK; Websitehttp://www.ecliptek.com; Environmental Compliance

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EMCL12N2H-124.400M Overview

CRYSTAL OSCILLATOR, CLOCK, 124.4MHz, LVPECL OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN

EMCL12N2H-124.400M Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ECLIPTEK
Reach Compliance Code	compliant
Other features	ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TAPE AND REEL
maximum descent time	0.3 ns
Frequency Adjustment - Mechanical	NO
frequency stability	25%
JESD-609 code	e4
Manufacturer's serial number	EMCL12
Installation features	SURFACE MOUNT
Nominal operating frequency	124.4 MHz
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Oscillator type	LVPECL
Output load	50 OHM
physical size	7.0mm x 5.0mm x 0.85mm
longest rise time	0.3 ns
Maximum supply voltage	2.625 V
Minimum supply voltage	2.375 V
Nominal supply voltage	2.5 V
surface mount	YES
maximum symmetry	55/45 %
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)

EMCL12N2H-124.400M Preview

EMCL12N2H-124.400M

Series

RoHS Compliant (Pb-free) 2.5V 6 Pad 5mm x 7mm

Plastic SMD LVPECL MEMS Oscillator

Frequency Tolerance/Stability

±25ppm Maximum over -20°C to +70°C

Duty Cycle

50 ±5(%)

RoHS

EMCL12 N 2 H -124.400M

Nominal Frequency

124.400MHz

Logic Control / Additional Output

Output Enable (OE) and Complementary Output

ELECTRICAL SPECIFICATIONS

Nominal Frequency

Frequency Tolerance/Stability

124.400MHz

±25ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C,

Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,

1st Year Aging at 25°C, Reflow, Shock, and Vibration)

±1ppm First Year Maximum

+2.5Vdc ±0.125Vdc

75mA Maximum (Excluding Load Termination Current)

1.55Vdc Typical, Vcc-1.025Vdc Minimum

0.80Vdc Typical, Vcc-1.62Vdc Maximum

150pSec Typical, 300pSec Maximum (Measured over 20% to 80% of waveform)

50 ±5(%) (Measured at 50% of waveform)

50 Ohms into Vcc-2.0Vdc

LVPECL

Output Enable (OE) and Complementary Output

Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc

Maximum to Disable Output and Complementary Output (High Impedance)

70mA Maximum (OE) Without Load

0.2pSec Typical

2.0pSec Typical

1.5pSec Typical, 3.0pSec Maximum

20pSec Typical, 25pSec Maximum

1.6pSec Typical

1.0pSec Typical

0.5pSec Typical

10mSec Maximum

-55°C to +125°C

Aging at 25°C

Supply Voltage

Input Current

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

Duty Cycle

Load Drive Capability

Output Logic Type

Logic Control / Additional Output

Output Control Input Voltage

Output Enable Current

Period Jitter (Deterministic)

Period Jitter (Random)

Period Jitter (RMS)

Period Jitter (pk-pk)

RMS Phase Jitter (Fj = 637kHz to

10MHz; Random)

RMS Phase Jitter (Fj = 1MHz to

20MHz; Random)

RMS Phase Jitter (Fj = 1.875MHz to

20MHz; Random)

Start Up Time

Storage Temperature Range

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

Flammability

Mechanical Shock

Moisture Resistance

Moisture Sensitivity Level

Resistance to Soldering Heat

Resistance to Solvents

Solderability

Temperature Cycling

Thermal Shock

Vibration

MIL-STD-883, Method 3015, Class 2, HBM 2000V

UL94-V0

MIL-STD-883, Method 2002, Condition G, 30,000G

MIL-STD-883, Method 1004

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 1011, Condition B

MIL-STD-883, Method 2007, Condition A, 20G

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 1 of 5

EMCL12N2H-124.400M

MECHANICAL DIMENSIONS (all dimensions in millimeters)

5.00

±0.15

0.85

±0.15

0.08

MAX

7.00

±0.15

5.08

±0.10

CONNECTION

Output Enable (OE)

No Connect

Case Ground

Output

Complementary Output

Supply Voltage

1.20 ±0.10 (x4)

1.47

2.30

LINE MARKING

2.54 TYP

2.60

±0.15

1.40

±0.10 (x4)

XXXX or XXXXX

XXXX or XXXXX=Ecliptek

Manufacturing Lot Code

Note A: Center paddle is connected

internally to oscillator ground (Pad 3).

Suggested Solder Pad Layout

All Dimensions in Millimeters

1.80 (X6)

2.00 (X6)

0.54 (X4)

2.39 (X3)

All Tolerances are ±0.1

Solder Land

(X6)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 2 of 5

EMCL12N2H-124.400M

OUTPUT WAVEFORM & TIMING DIAGRAM

TRI-STATE INPUT

CLOCK OUTPUTS

80%

50%

20%

OUTPUT DISABLE

(HIGH IMPEDANCE

STATE)

PLZ

Fall

Time

Rise

Time

Duty Cycle (%) = T

/T x 100

PZL

Test Circuit for Tri-State and Complementary Output

50 Ohms

Pin Connections

1 Tri-State

2 No Connect

3 Ground

4 Output

5 Complementary Output

6 Supply Voltage (V

)

Oscilloscope

Frequency

Counter

Power

Supply

Voltage

)

Current

Meter

0.01µF

(Note 1)

0.1µF

(Note 1)

Complementary

Output

Probe 2

(Note 2)

Output

Probe 1

(Note 2)

50 Ohms

Switch

Power

Supply

Voltage

Meter

Power

Supply

Ground

Tri-State

Connect

Power

Supply

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)

to the package ground and supply voltage pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is

recommended.

Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 3 of 5

EMCL12N2H-124.400M

Recommended Solder Reflow Methods

Critical Zone

to T

Ramp-up

Ramp-down

Temperature (T)

Max

Min

Preheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

MAX to T

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

MIN)

- Temperature Typical (T

TYP)

- Temperature Maximum (T

MAX)

- Time (t

MIN)

Ramp-up Rate (T

to T

)

Time Maintained Above:

- Temperature (T

)

- Time (t

)

Peak Temperature (T

)

Target Peak Temperature (T

Target)

Time within 5°C of actual peak (t

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

3°C/second Maximum

150°C

175°C

200°C

60 - 180 Seconds

3°C/second Maximum

217°C

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 4 of 5

EMCL12N2H-124.400M

Recommended Solder Reflow Methods

Critical Zone

to T

Ramp-up

Ramp-down

Temperature (T)

Max

Min

Preheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 240°C

MAX to T

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

MIN)

- Temperature Typical (T

TYP)

- Temperature Maximum (T

MAX)

- Time (t

MIN)

Ramp-up Rate (T

to T

)

Time Maintained Above:

- Temperature (T

)

- Time (t

)

Peak Temperature (T

)

Target Peak Temperature (T

Target)

Time within 5°C of actual peak (t

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

5°C/second Maximum

N/A

150°C

N/A

60 - 120 Seconds

5°C/second Maximum

150°C

200 Seconds Maximum

240°C Maximum

240°C Maximum 1 Time / 230°C Maximum 2 Times

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 5 of 5

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