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Datasheet> All Categories > logic> logic> UPB1502GR-E1
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UPB1502GR-E1

Description
PRESCALER
Categorylogic    logic   
File Size270KB，18 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric View All

UPB1502GR-E1 Overview

PRESCALER

UPB1502GR-E1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Parts packaging codeSOIC
package instructionSOP, SOP8,.25
Contacts8
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G8
JESD-609 codee0
Logic integrated circuit typePRESCALER
Maximum Frequency@Nom-Sup1700000000 Hz
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply3 V
Maximum supply current (ICC)11 mA
Certification statusNot Qualified
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyBIPOLAR
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL

UPB1502GR-E1 Preview

To our customers,
Old Company Name in Catalogs and Other Documents
On April 1
st
, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas
Electronics Corporation
took over all the business of both
companies.
Therefore, although the old company name remains in this document, it is a valid
Renesas
Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1
st
, 2010
Renesas Electronics Corporation
Issued by:
Renesas Electronics Corporation
(http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”:
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
“Standard”:
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
DATA SHEET
BIPOLAR DIGITAL INTEGRATED CIRCUITS
µ
PB1502GR,
1502GR(1)
1.7 GHz/ 2.0 GHz LOW-POWER TWO-MODULUS PRESCALER
DIVIDED-BY-64/65, 128/129
FEATURES
•
•
•
•
•
•
High toggle frequency – 2.0 GHz:
µ
PB1502GR(1), 1.7 GHz:
µ
PB1502GR
Low power consumption – 6.7 mA TYP. at 3 V
Operating supply voltage – 2.7 V to 3.3 V
High input sensitivity – 130 to 220 mV
P-P
:
µ
PB1502GR(1), 100 to 320 mV
P-P
:
µ
PB1502GR (@50
Ω)
Equipped with power-save function: 5
µ
A (standard) on power-save mode.
Packaged in 8 pins plastic SOP suitable for surface mounting.
DESCRIPTION
µ
PB1502GR and
µ
PB1502GR(1) are two-modulus prescaler divided by 64/65 or 128/129. This device is designed for
mobile communication applications for example 0.8-1.9 GHz cellular and cordless telephones. The ICs operate on low power
and therefore are suitable for hand-held, battery-operated systems.
nitride passivation film and gold metallization wirings. These materials can protect the chips from external pollution and
prevent corrosion and migration. Thus, these products have excellent performance, uniformity and reliability.
ORDER INFORMATION
ORDER NUMBER
PACKAGE
nt
in
ue
The mark
SUPPLYING FORM
d
These products are manufactured using NEC’s 20 GHz f
T
NESAT™
III
silicon bipolar process. This process uses silicon
µ
PB1502GR–E1
µ
PB1502GR(1)–E1
8 pin plastic SOP
(225 mil)
Embossed tape 12 mm wide. QTY 2.5 k/reel
Pin1 is in tape pull-out direction.
Remarks
To order evaluation samples, please contact your local NEC sales office. (Order number:
µ
PB1502GR,
µ
PB1502GR(1))
D
is
co
Caution electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. P10871EJ3V0DS00 (3rd edition)
Date Published October 1999 N CP(K)
Printed in Japan
shows major revised points.
Pr
od
uc
t
f
in
MAX.
1.7 GHz
2.0 GHz
©
1996, 1999
µ
PB1502GR, 1502GR(1)
PIN ASSIGNMENT
(Top View)
IN
V
CC
SW
OUT
IN
V
PS
M
INTERNAL BLOCK DIAGRAM
(2) V
CC
(7) V
PS
D
CK
CK
(8)IN
(1)IN
DFF
1
Q
D
CK
CK
DFF
2
Q
Q
Q
d
T
Q
TFF
4
in
ue
Q
T
Q
TFF
2
TFF
3
T
Q
T
TFF
1
nt
co
: pin
2
D
is
( ) : pin No.
Data Sheet P10871EJ3V0DS00
Pr
od
uc
t
(5) GND
D
Q
CK
CK
DFF
3
Q
M(6)
T
SW
Q
OR
TFF
5
OUT(4)
AMP
SW(3)
GND
µ
PB1502GR, 1502GR(1)
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply voltage
Input voltage
Total power dissipation
Operating temperature
Storage temperature
SYMBOL
V
CC
V
IN
P
D
T
opt
T
stg
RATINGS
–0.5 to +6
–0.5 to V
CC
+0.5
250
–40 to +85
–65 to +150
UNIT
V
V
mW
°C
°C
T
A
= +25
°C
T
A
= +25
°C
Mounted on double sided copper clad 50
×
50
×
1.6 mm epoxy glass PWB (T
A
= +85
°C)
CONDITION
RECOMMENDED OPERATING RANGE
PARAMETER
Supply voltage
Operating temperature
SYMBOL
V
CC
T
opt
MIN.
2.7
–40
TYP.
3.0
+25
ELECTRICAL CHARACTERISTICS (T
A
= – 40 to +85
°
C, V
CC
= 2.7 to 3.3 V)
µ
PB1502GR
PARAMETER
Response frequency
Circuit current
Input power sensitivity 1
Input power sensitivity 2
Input power sensitivity 3
Input power sensitivity 4
Modulus control input high (M)
Modulus control input low (M)
SYMBOL
MIN.
f
in
I
CC
0.5
3.2
TYP.
1.7
MAX.
d
11.0
0
0
–6
—
—
0.8
V
CC
—
—
V
CC
0.8
20
nt
in
ue
6.7
—
—
—
P
in1
P
in2
P
in3
P
in4
–11
–15
–15
—
—
V
IH1
2.5
—
—
V
IL1
—
Divide ratio control input high (SW)
Divide ratio control input low (SW)
Output voltage swing
Modulus set up time
V
IH2
V
IL2
V
CC
V
CC
co
OPEN OPEN OPEN OPEN OPEN OPEN
0.8
—
V
CC
—
—
—
11
V
CC
—
5
0.8
—
V
CC
—
—
—
11
V
CC
—
5
—
—
V
CC
0.8
20
V
OUT
t
set
V
PS
H
V
in
L
I
PS
Power-save input high
Power-save input low
is
Pr
od
uc
t
MAX.
3.3
UNIT
V
+85
°C
µ
PB1502GR(1)
TYP.
UNIT
GHz
mA
dBm
dBm
dBm
dBm
V
V
V
V
V
P–P
ns
V
V
CONDITION
MIN.
0.5
MAX.
2.0
P
in
= –10 dBm
V
PS
H level,
No input signal
f
in
= 0.5 to 0.8 GHz
f
in
= 0.8 to 1.5 GHz
f
in
= 1.5 to 1.7 GHz
f
in
= 1.7 to 2.0 GHz
3.2
6.7
—
—
—
—
—
—
V
CC
11.0
0
0
–1
–9
—
0.8
V
CC
–11
–15
–15
–14
2.5
—
V
CC
C
L
= 8 pF
f
in
MAX.
V
PS
L level
V
PS
L level
*
*
D
Circuit current on power-save mode
µ
A
*
Standard reference value on power-save mode.
Data Sheet P10871EJ3V0DS00
3
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