D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | LG Semicon Co., Ltd. |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 22000000 Hz |
| MaximumI(ol) | 0.004 A |
| Number of functions | 8 |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Trigger type | POSITIVE EDGE |
| GD74HCT273J | GD54HC273J | GD74HC273 | GD74HC273J | GD54HCT273J | GD74HCT273D | GD74HCT273 | GD74HC273D | |
|---|---|---|---|---|---|---|---|---|
| Description | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDSO20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDSO20, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 22000000 Hz | 20000000 Hz | 25000000 Hz | 25000000 Hz | 18000000 Hz | 22000000 Hz | 22000000 Hz | 25000000 Hz |
| MaximumI(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| Number of functions | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | SOP | DIP | SOP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 | DIP20,.3 | SOP20,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| power supply | 5 V | 2/6 V | 2/6 V | 2/6 V | 5 V | 5 V | 5 V | 2/6 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Maker | LG Semicon Co., Ltd. | - | - | - | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | - | DIP, DIP20,.3 | DIP, DIP20,.3 | - | - | SOP, SOP20,.4 |