FIFO, 16KX9, 9ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | QFP |
| package instruction | LQFP, QFP64,.66SQ,32 |
| Contacts | 64 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 9 ns |
| Other features | CAN ALSO BE CONFIGURED AS 8K X 18 |
| Spare memory width | 9 |
| Maximum clock frequency (fCLK) | 83.3 MHz |
| period time | 12 ns |
| JESD-30 code | S-PQFP-G64 |
| JESD-609 code | e0 |
| length | 14 mm |
| memory density | 147456 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 64 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 16KX9 |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LQFP |
| Encapsulate equivalent code | QFP64,.66SQ,32 |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Maximum slew rate | 0.11 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 20 |
| width | 14 mm |
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