TC551001BFTI-85V datasheet, PDF

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TC551001BFTI-85V: DescriptionIC 128K X 8 STANDARD SRAM, 200 ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP-32, Static RAM; Categorystorage storage; File Size470KB，16 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC551001BFTI-85V Overview

IC 128K X 8 STANDARD SRAM, 200 ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP-32, Static RAM

TC551001BFTI-85V Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	TSOP
package instruction	TSOP1,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	200 ns
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	18.4 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.2 mm
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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Description	IC 128K X 8 STANDARD SRAM, 200 ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP-32, Static RAM	IC 128K X 8 STANDARD SRAM, 200 ns, PDSO32, 8 X 20 MM, PLASTIC, REVERSE, TSOP-32, Static RAM	IC 128K X 8 STANDARD SRAM, 200 ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP-32, Static RAM	IC 128K X 8 STANDARD SRAM, 200 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Static RAM	IC 128K X 8 STANDARD SRAM, 200 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Static RAM	IC 128K X 8 STANDARD SRAM, 200 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Static RAM	IC 128K X 8 STANDARD SRAM, 200 ns, PDSO32, 8 X 20 MM, PLASTIC, REVERSE, TSOP-32, Static RAM
Parts packaging code	TSOP	TSOP	TSOP	DIP	DIP	SOIC	TSOP
package instruction	TSOP1,	TSOP1-R,	TSOP1,	DIP,	DIP,	SOP,	TSOP1-R,
Contacts	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible
Maker	Toshiba Semiconductor	-	-	-	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor
Maximum access time	200 ns	200 ns	-	200 ns	200 ns	200 ns	200 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	-	R-PDIP-T32	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	e0	e0	-	e0	e0	e0	e0
length	18.4 mm	18.4 mm	-	42 mm	42 mm	20.6 mm	18.4 mm
memory density	1048576 bit	1048576 bit	-	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	-	8	8	8	8
Number of functions	1	1	-	1	1	1	1
Number of ports	1	1	-	1	1	1	1
Number of terminals	32	32	-	32	32	32	32
word count	131072 words	131072 words	-	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	-	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
organize	128KX8	128KX8	-	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	-	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	TSOP1-R	-	DIP	DIP	SOP	TSOP1-R
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	-	4.8 mm	4.8 mm	2.8 mm	1.2 mm
Minimum standby current	2 V	2 V	-	2 V	2 V	2 V	2 V
Maximum supply voltage (Vsup)	5.5 V	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	-	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	5 V	5 V	-	5 V	5 V	5 V	5 V
surface mount	YES	YES	-	NO	NO	YES	YES
technology	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	-	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	-	2.54 mm	2.54 mm	1.27 mm	0.5 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8 mm	8 mm	-	15.24 mm	15.24 mm	10.7 mm	8 mm

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