AM29705AFMB datasheet, PDF - EEWORLD Datasheet

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AM29705AFMB: DescriptionMulti-Port SRAM, 16X4, 30ns, CMOS, PDFP28, FLAT PACK-28; Categorystorage storage; File Size2MB，11 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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AM29705AFMB Overview

Multi-Port SRAM, 16X4, 30ns, CMOS, PDFP28, FLAT PACK-28

AM29705AFMB Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DFP,
Reach Compliance Code	unknown
Maximum access time	30 ns
JESD-30 code	R-PDFP-F28
JESD-609 code	e0
memory density	64 bit
Memory IC Type	MULTI-PORT SRAM
memory width	4
Number of functions	1
Number of terminals	28
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16X4
Package body material	PLASTIC/EPOXY
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	FLAT
Terminal location	DUAL

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REI Datasheet

AM29705A, AM29707

16-Word by 4-Bit 2-Port RAM

The AM29705A is a 16-word by 4-bit, two-power RAM. This RAM features two separate output ports

such that any two 4-bit words can be read from these outputs simultaneously. Each output port has

a four-bit Latch but a common Latch Enable (LE) input is used to control all eight latches. The device

has two Write Enable (WE) inputs and is designed such that the Write Enable 1 (WE

) and Latch

Enable (LE) inputs can be wired together to make the operation of the RAM appear edge triggered.

The device has a fully decoded four-bit A-address field to address any of the 16 memory words for

the A-output port. Likewise, a four-bit B-address input is used to simultaneously select any of the 16

words for presentation at the B-output port. New incoming data is written into the four-bit RAM word

selected by the B-address. The D inputs are used to load new data into the device.

Rochester Electronics

Manufactured Components

Rochester branded components are

manufactured using either die/wafers

purchased from the original suppliers

or Rochester wafers recreated from the

original IP. All recreations are done with

the approval of the OCM.

Parts are tested using original factory

test programs or Rochester developed

test solutions to guarantee product

meets or exceeds the OCM data sheet.

Quality Overview

•

ISO-9001

• AS9120 certification

• Qualified Manufacturers List (QML) MIL-PRF-38535

•

Class Q Military

•

Class V Space Level

• Qualified Suppliers List of Distributors (QSLD)

•

Rochester is a critical supplier to DLA and

meets all industry and DLA standards.

Rochester Electronics, LLC is committed to supplying

products that satisfy customer expectations for

quality and are equal to those originally supplied by

industry manufacturers.

The original manufacturer’s datasheet accompanying this document reflects the performance

and specifications of the Rochester manufactured version of this device. Rochester Electronics

guarantees the performance of its semiconductor products to the original OEM specifications.

‘Typical’ values are for reference purposes only. Certain minimum or maximum ratings may be

based on product characterization, design, simulation, or sample testing.

To learn more, please visit

www.rocelec.com

AM29705AFMB Related Products

	AM29705AFMB	AM29705AFM	AM29705ADC	AM29705APC	AM29705ADMB	AM29705ALMB
Description	Multi-Port SRAM, 16X4, 30ns, CMOS, PDFP28, FLAT PACK-28	Multi-Port SRAM, 16X4, 30ns, TTL, CDFP28, FP-28	Multi-Port SRAM, 16X4, 25ns, TTL, CDIP28, CERAMIC, SLIMDIP-28	Multi-Port SRAM, 16X4, 25ns, TTL, PDIP28, DIP-28	Multi-Port SRAM, 16X4, 30ns, CMOS, CDIP28, CERAMIC, SLIMDIP-28	Multi-Port SRAM, 16X4, 30ns, CMOS, CHIP-28
package instruction	DFP,	DFP,	DIP,	DIP,	DIP,	DIE,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
Maximum access time	30 ns	30 ns	25 ns	25 ns	30 ns	30 ns
JESD-30 code	R-PDFP-F28	S-CDFP-F28	R-CDIP-T28	R-PDIP-T28	R-CDIP-T28	S-XUUC-N28
memory density	64 bit	64 bit	64 bit	64 bit	64 bit	64 bi
Memory IC Type	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM
memory width	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28
word count	16 words	16 words	16 words	16 words	16 words	16 words
character code	16	16	16	16	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	70 °C	70 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-	-	-55 °C	-55 °C
organize	16X4	16X4	16X4	16X4	16X4	16X4
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
encapsulated code	DFP	DFP	DIP	DIP	DIP	DIE
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	FLATPACK	FLATPACK	IN-LINE	IN-LINE	IN-LINE	UNCASED CHIP
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.25 V	5.25 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.75 V	4.75 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	NO	YES
technology	CMOS	TTL	TTL	TTL	CMOS	CMOS
Temperature level	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal form	FLAT	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	UPPER
Maker	Rochester Electronics	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics

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