ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, DIE
| Parameter Name | Attribute value |
| Maker | Thales Group |
| Parts packaging code | DIE |
| package instruction | , |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Converter type | ADC, FLASH METHOD |
| JESD-30 code | X-XUUC-N |
| Maximum linear error (EL) | 0.4688% |
| Number of analog input channels | 1 |
| Number of digits | 8 |
| Number of functions | 1 |
| Maximum operating temperature | 25 °C |
| Minimum operating temperature | 25 °C |
| Output bit code | BINARY |
| Output format | PARALLEL, 8 BITS |
| Package body material | UNSPECIFIED |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| Certification status | Not Qualified |
| Sampling rate | 20 MHz |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| JTS83H38-1VA | TS83H38MC8B/C | TS83H38VC8 | TS83H38VC8B/C | |
|---|---|---|---|---|
| Description | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, DIE | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, CERAMIC, DIP-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, CERAMIC, DIP-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, CERAMIC, DIP-28 |
| Maker | Thales Group | Thales Group | Thales Group | Thales Group |
| Parts packaging code | DIE | DIP | DIP | DIP |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | 3A001.A.2.C | EAR99 | EAR99 |
| Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 code | X-XUUC-N | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 |
| Maximum linear error (EL) | 0.4688% | 0.7812% | 0.7812% | 0.7812% |
| Number of analog input channels | 1 | 1 | 1 | 1 |
| Number of digits | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Maximum operating temperature | 25 °C | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | 25 °C | -55 °C | -40 °C | -40 °C |
| Output bit code | BINARY | BINARY | BINARY | BINARY |
| Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| Package body material | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Sampling rate | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | OTHER | MILITARY | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | UPPER | DUAL | DUAL | DUAL |
| Contacts | - | 28 | 28 | 28 |
| Number of terminals | - | 28 | 28 | 28 |
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