BCR
Vishay Electro-Films
Thin Film, Back-Contact Resistor
CHIP
RESISTORS
FEATURES
•
Wire bondable
Product may not
be to scale
•
Only one wire bond required
•
Small size: 0.020 inches square.
•
Resistance range: 10
Ω
to 1 MΩ
•
Oxidized silicon substrate for good power dissipation
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips available.
The BCR requires only one wire bond thus saving hybrid space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883.
•
Resistor material: Tantalum nitride, self-passivating
•
Moisture resistant
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting
the resistor to the bottom of the chip.)
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
5%
2%
1%
0.5 % 0.2 %
0.1 %
PROCESS CODE
CLASS H*
CLASS K*
056
061
059
052
010
002
027
008
*MIL-PRF-38534 inspection criteria
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
360 kΩ
1 MΩ
200 kΩ
620 kΩ
10
Ω
20
Ω
50
Ω
100
Ω
200
Ω
1 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
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54
For technical questions, contact: efi@vishay.com
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± 1.0 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
75 V max.
250 mW
± 0.25 % max.
ΔR/R
Document Number: 61023
Revision: 12-Mar-08
BCR
Thin Film, Back-Contact Resistor
Vishay Electro-Films
DIMENSIONS
in inches
0.020
CHIP
RESISTORS
0.016
0.020
0.004
TYPICAL RANGE
10
Ω
- 23
Ω
TYPICAL RANGE
24
Ω
- 220
Ω
TYPICAL RANGE
180
Ω
- 2.2 kΩ
TYPICAL RANGE
1.6 kΩ - 1 MΩ
Note:
• Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection.
SCHEMATIC
Bond Pad
Back of Chip
MECHANICAL SPECIFICATIONS
in inches
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
Backing
Recommended Attachment Method
Options:
Gold bonding pads, 15 kÅ minimum thickness
Consult Applications Engineer
0.020 x 0.020 ± 0.002 (0.50 x 0.50 ± 0.05 mm)
0.010 ± 0.003 (0.253 ± 0.05 mm)
Oxidized silicon, 10 kÅ minimum SiO
2
Tantalum nitride, self-passivating
0.004 x 0.004 (0.100 x 0.100 mm)
1
10 kÅ minimum aluminum
3 kÅ minimum gold
Eutectic or conductive epoxy
ORDERING INFORMATION
Example: 100 % visual, 16 kΩ, ± 1 %, ± 250 ppm/°C TCR, aluminum pads, class H visual inspection
W
INSPECTION/
PACKAGING
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample, visually inspected
parts loaded in matrix trays
(4 % AQL)
BCR
PRODUCT
FAMILY
008
PROCESS
CODE
See Process Code
table
1600
RESISTANCE
VALUE
Use first 4 digits
significant digits of the
resistance
1
MULTIPLIER
CODE
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
F
TOLERANCE
CODE
B
= 0.1 %
C
= 0.2 %
D
= 0.5 %
F
= 1.0 %
G
= 2.0 %
H
= 2.5 %
J
= 5.0 %
K
= 10 %
Document Number: 61023
Revision: 12-Mar-08
For technical questions, contact: efi@vishay.com
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55
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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Embedded System
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