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2SA1162GT1, 2SA1162YT1
General Purpose
Amplifier Transistors
PNP Surface Mount
•
Moisture Sensitivity Level: 1
•
ESD Rating: TBD
MAXIMUM RATINGS
(T
A
= 25°C)
Rating
Collector−Base Voltage
Collector−Emitter Voltage
Emitter−Base Voltage
Collector Current − Continuous
Collector Current − Peak
Base Current
Symbol
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
C
I
C(P)
I
B
Value
50
50
7.0
150
200
30
Unit
Vdc
Vdc
Vdc
mAdc
mAdc
mAdc
2
Symbol
P
D
T
J
T
stg
Max
200
150
−55 to +150
Unit
mW
°C
°C
1
SC−59
CASE 318D
STYLE 1
2
BASE
1
EMITTER
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COLLECTOR
3
MARKING DIAGRAM
3
SAx M
THERMAL CHARACTERISTICS
Characteristic
Power Dissipation
Junction Temperature
Storage Temperature
SA = Specific Device Code
x
= G or Y
M = Date Code
ORDERING INFORMATION
Device†
2SA1162GT1
2SA1162YT1
Package
SC−59
SC−59
Shipping
†
3000/Tape & Reel
3000/Tape & Reel
†The “T1” suffix refers to a 7 inch reel.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2003
1
October, 2003 − Rev. 0
Publication Order Number:
2SA1162GT1/D
2SA1162GT1, 2SA1162YT1
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Collector−Emitter Breakdown Voltage (I
C
= 2.0 mAdc, I
B
= 0)
Collector−Base Breakdown Voltage (I
C
= 10
mAdc,
I
E
= 0)
Emitter−Base Breakdown Voltage (I
E
= 10
mAdc,
I
C
= 0)
Collector−Base Cutoff Current (V
CB
= 50 Vdc, I
E
= 0)
Emitter Cut−off Current (V
EB
= 5 V, I
C
= 0 V)
Collector−Emitter Cutoff Current
(V
CE
= 10 Vdc, I
B
= 0)
(V
CE
= 30 Vdc, I
B
= 0)
DC Current Gain (Note 1)
(V
CE
= 6.0 Vdc, I
C
= 2.0 mAdc)
2SA1162YT1
2SA1162GT1
V
CE(sat)
Symbol
V
(BR)CEO
V
(BR)CBO
V
(BR)EBO
I
CBO
I
EBO
I
CEO
−
−
h
FE
120
200
−
240
400
0.3
Vdc
0.1
2.0
Min
50
50
7.0
−
−
Max
−
−
−
0.1
0.1
Unit
Vdc
Vdc
Vdc
mAdc
mA
mAdc
mAdc
−
Collector−Emitter Saturation Voltage (I
C
= 100 mAdc, I
B
= 10 mAdc)
SMALL−SIGNAL CHARACTERISTICS
Current −Gain − Bandwidth Product
(I
C
= 1.0 mA, V
CE
= 10.0 V, f = 10 MHz)
Output Capacitance
(V
CB
= 10 V, f = 1.0 MHz)
Noise Figure
(I
C
= 0.1 mA, V
CE
= 6.0 Vdc, R
S
= 10 kW, f = 1.0 kHz, BW = 200 Hz)
1. Pulse Test: Pulse Width
≤
300
ms,
D.C.
≤
2%.
f
T
80
C
obo
−
NF
−
10
7.0
dB
−
pF
MHz
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2
2SA1162GT1, 2SA1162YT1
INFORMATION FOR USING THE SC−59 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
0.037
0.95
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.094
2.4
0.039
1.0
0.031
0.8
inches
mm
SC−59 POWER DISSIPATION
The power dissipation of the SC−59 is a function of the
pad size. This can vary from the minimum pad size for sol-
dering to the pad size given for maximum power dissipa-
tion. Power dissipation for a surface mount device is deter-
mined by T
J(max)
, the maximum rated junction temperature
of the die, Rq
JA
, the thermal resistance from the device
junction to ambient; and the operating temperature, T
A
. Us-
ing the values provided on the data sheet, P
D
can be calcu-
lated as follows.
P
D
=
T
J(max)
− T
A
R
qJA
the equation for an ambient temperature T
A
of 25°C, one
can calculate the power dissipation of the device which in
this case is 338 milliwatts.
P
D
=
150°C − 25°C
370°C/W
= 338 milliwatts
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
The 370°C/W assumes the use of the recommended foot-
print on a glass epoxy printed circuit board to achieve a
power dissipation of 338 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad™. Using a board material such
as Thermal Clad, the power dissipation can be doubled us-
ing the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are sub-
jected.
•
Always preheat the device.
•
The delta temperature between the preheat and solder-
ing should be 100°C or less.*
•
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum tem-
perature ratings as shown on the data sheet. When us-
ing infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
•
The soldering temperature and time should not exceed
260°C for more than 10 seconds.
•
When shifting from preheating to soldering, the maxi-
mum temperature gradient should be 5°C or less.
•
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and re-
sult in latent failure due to mechanical stress.
•
Mechanical stress or shock should not be applied dur-
ing cooling
* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.
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3
2SA1162GT1, 2SA1162YT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of con-
trol settings that will give the desired heat pattern. The op-
erator must set temperatures for several heating zones, and
a figure for belt speed. Taken together, these control set-
tings make up a heating “profile” for that particular circuit
board. On machines controlled by a computer, the comput-
er remembers these profiles from one operating session to
the next. Figure 1 shows a typical heating profile for use
when soldering a surface mount device to a printed circuit
board. This profile will vary among soldering systems but
it is a good starting point. Factors that can affect the profile
include the type of soldering system in use, density and
types of components on the board, type of solder used, and
the type of board or substrate material being used. This pro-
file
shows
temperature
versus
time.
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177−189°C. When this type of furnace is used for solder re-
flow work, the circuit boards and solder joints tend to heat
first. The components on the board are then heated by con-
duction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then dis-
tributes this energy to the components. Because of this ef-
fect, the main body of a component may be up to 30 degrees
cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
STEP 2
STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
SPIKE"
SOAK"
170°C
160°C
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
150°C
100°C
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
50°C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
Figure 1. Typical Solder Heating Profile
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