2SK2615
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (L
−π−MOSV)
2
2SK2615
DC−DC Converter, Relay Drive and Motor Drive
Applications
Low drain−source ON resistance
High forward transfer admittance
Low leakage current
Enhancement mode
: R
DS (ON)
= 0.23
Ω
(typ.)
: |Y
fs
| = 2.0 S (typ.)
Unit: mm
: I
DSS
= 100
μA
(max) (V
DS
= 60 V)
: V
th
= 0.8 to 2.0 V (V
DS
= 10 V, I
D
= 1 mA)
Absolute Maximum Ratings
(Ta = 25°C)
Characteristics
Drain−source voltage
Drain−gate voltage (R
GS
= 20 kΩ)
Gate−source voltage
Drain current
Drain power dissipation
Drain power dissipation
Channel temperature
Storage temperature range
(Note 2)
DC
(Note 1)
Symbol
V
DSS
V
DGR
V
GSS
I
D
I
DP
P
D
P
D
T
ch
T
stg
Rating
60
60
±20
2
6
0.5
1.5
150
−55
to 150
Unit
V
V
V
A
W
W
°C
°C
Pulse (Note 1)
JEDEC
JEITA
TOSHIBA
―
―
2-5K1B
Note 1: Ensure that the channel temperature does not exceed 150°C.
Note 2: Mounted on a ceramic substrate (25.4 mm × 25.4 mm × 0.8 mm)
Weight: 0.05 g (typ.)
Note 3:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change
in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics
Thermal resistance, channel to
ambient
Symbol
R
th (ch−a)
Max
250
Unit
°C / W
This transistor is an electrostatic-sensitive device.
Please handle with caution.
Marking
Part No. (or abbreviation code)
Note 4: A line to the right of a Lot No. identifies the indication of
product Labels.
Without a line: [[Pb]]/INCLUDES > MCV
With a line: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to
environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament
and of the Council of 27 January 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment.
Z
Lot No.
A
Note 4
1
2009-09-29
2SK2615
Electrical Characteristics
(Ta = 25°C)
Characteristics
Gate leakage current
Drain cut−off current
Drain−source breakdown voltage
Gate threshold voltage
Drain−source ON resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
Rise time
Symbol
I
GSS
I
DSS
V
(BR) DSS
V
th
R
DS (ON)
|Y
fs
|
C
iss
C
rss
C
oss
t
r
t
on
t
f
t
off
Q
g
Q
gs
Q
gd
V
DD
≈
48 V, V
GS
= 10 V, I
D
= 2 A
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
Test Condition
V
GS
= ±16 V, V
DS
= 0 V
V
DS
= 60 V, V
GS
= 0 V
I
D
= 10 mA, V
GS
= 0 V
V
DS
= 10 V, I
D
= 1 mA
VGS = 4 V, ID = 1 A
VGS = 10 V, ID = 1 A
V
DS
= 10 V, I
D
= 1 A
Min
—
—
60
0.8
—
—
1.0
—
—
—
—
Typ.
—
—
—
—
0.33
0.23
2.0
150
25
70
25
Max
±10
100
—
2.0
0.44
0.30
—
—
—
—
—
pF
Unit
μA
μA
V
V
Ω
S
Turn−on time
Switching time
Fall time
—
30
—
ns
—
50
—
Turn−off time
Total gate charge (gate−source
plus gate−drain)
Gate−source charge
Gate−drain (“miller”) Charge
—
—
—
—
150
6.0
4.6
1.4
—
—
—
—
nC
Source−Drain Ratings and Characteristics
(Ta = 25°C)
Characteristics
Continuous drain reverse current
(Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovery charge
Symbol
I
DR
I
DRP
V
DSF
t
rr
Q
rr
I
DR
= 2 A, V
GS
= 0 V
I
DR
= 2 A, V
GS
= 0 V
dI
DR
/ dt = 50 A /
μs
Test Condition
—
—
Min
—
—
—
—
—
Typ.
—
—
—
100
40
Max
2
6
−1.5
—
—
Unit
A
A
V
ns
nC
2
2009-09-29
Microcontroller MCU
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