D Latch, 1-Func, 8-Bit, CMOS, PDSO20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Mitsubishi |
| package instruction | SOP, SOP20,.4 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G20 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D LATCH |
| MaximumI(ol) | 0.006 A |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP20,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 2/6 V |
| Prop。Delay @ Nom-Sup | 38 ns |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |





| M74HC533DWP | M74HC533-1DWP | M74HC533FP | |
|---|---|---|---|
| Description | D Latch, 1-Func, 8-Bit, CMOS, PDSO20 | D Latch, 1-Func, 8-Bit, CMOS, PDSO20 | D Latch, 1-Func, 8-Bit, CMOS, PDSO20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Mitsubishi | Mitsubishi | Mitsubishi |
| package instruction | SOP, SOP20,.4 | SOP, SOP20,.4 | SOP, SOP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609 code | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D LATCH | D LATCH | D LATCH |
| MaximumI(ol) | 0.006 A | 0.024 A | 0.006 A |
| Number of digits | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP |
| Encapsulate equivalent code | SOP20,.4 | SOP20,.4 | SOP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 2/6 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Sup | 38 ns | 25 ns | 38 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |