*
All ABL's BGA heatsinks are supplied with thermal tape
Width
Model
[mm]
Length
[mm]
Height
[mm]
Pad Size
[mm]
Anodised
Finish
°C/W
Natural
°C/W
Forced
2M/s
Wire Form
*BGA-FC-010
BGA-FC-015
40
40
40
40
10.0
24.0
20x20
30x30
Black
Black
13.50
11.00
7.00
5.50
WF700/WF300
WF700/WF300
Thermally Conductive Aluminium Foil
Tape
All ABL's BGA heatsinks are supplied with
thermal tape.
With
excellent
thermal
conductivity,
cushioning and gap filling properties, the pad
is an ideal thermal interface material
specifically designed for heat sink attachment
to MPU, chip set and other plastic
encapsulated components.
It consists of an aluminium foil backing
coated, on both sides, with a very high
temperature resistance acrylic adhesive. Due
to its high heat performance and adhesive
properties this tape can also be use to attach
components to a vertical heatsink and to
metal enclosure surfaces.
Colour
Backing Type / Thickness
Adhesive Type / Thickness
Total Thickness
Adhesion
Thermal Conductivity
Thermal Resistance
Holding Power@23°C
Holding Power @ 130°C
-
Mm
Mm
mm
Kg/25mm
W/m-K
°C-in /W
Hour
Hour
2
White
Aluminium Foil / 0.10
Arylic 0.075 (on clear liner side)
0,27
1,5
0,95
0,2
>72
>2
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