*
All ABL's BGA heatsinks are supplied with thermal tape
Width
Model
[mm]
Length
[mm]
Height
[mm]
Pad
Size
[mm]
Wire Form
°C/W
Natural
°C/W
Forced
2M/s
BGA-STD-010
BGA-STD-015
BGA-STD-020
BGA-STD-025
BGA-STD-030
BGA-STD-035
BGA-STD-040
BGA-STD-045
BGA-STD-050
BGA-STD-055
*BGA-STD-060
BGA-STD-065
BGA-STD-070
BGA-STD-075
BGA-STD-080
BGA-STD-085
BGA-STD-090
BGA-STD-095
BGA-STD-100
BGA-STD-105
BGA-STD-110
BGA-STD-115
BGA-STD-120
13.5
14.0
21.0
23.0
27.0
26.0
27.0
23.0
20.0
25.9
40.0
27.8
40.0
40.0
27.0
30.7
40.0
40.0
38.1
35.0
35.0
40.0
40.6
13.0
14.0
21.0
23.0
27.0
26.0
27.0
23.0
20.0
23.9
40.0
27.8
40.0
40.0
27.0
30.7
23.9
40.0
38.1
35.0
35.0
40.0
38.8
10.0
10.0
9.0
6.0
6.0
8.0
6.0
18.0
19.1
10.0
10.0
11.2
25.0
23.0
25.0
14.1
10.0
10.0
16.0
18.0
25.0
18.0
30.5
12x12
18x18
20X20
20x20
20x20
20x20
20x20
20x20
18x18
20x20
30x30
20x20
30x30
18x18
20x20
20x20
20x20
18x18
30x30
30x30
30x30
30x30
30x30
-
-
-
-
WF700/WF300
WF700/WF300
WF700/WF300
WF700/WF300
-
WF700/WF300/WF151
-
WF700/WF300
WF700/WF300/WF151
WF700/WF300/WF151
WF700/WF300/WF151
WF700/WF300
-
WF700/WF300
-
WF700/WF300/WF151
WF700/WF300/WF151
WF700/WF300/WF151
-
27.00
26.50
24.50
22.00
20.00
18.50
16.00
14.70
14.00
14.00
13.50
12.20
11.50
11.00
10.50
10.00
10.00
9.70
9.20
9.20
8.50
8.20
7.00
14.50
14.00
13.00
10.50
10.00
9.70
10.20
7.30
5.80
6.00
7.50
5.80
6.00
5.60
4.50
5.20
5.20
4.00
4.10
5.20
5.00
5.10
3.70
Thermally Conductive Aluminium Foil
Tape
All ABL's BGA heatsinks are supplied with
thermal tape.
With
excellent
thermal
conductivity,
cushioning and gap filling properties, the pad
is an ideal thermal interface material
specifically designed for heat sink attachment
to MPU, chip set and other plastic
encapsulated components.
It consists of an aluminium foil backing
coated, on both sides, with a very high
temperature resistance acrylic adhesive. Due
to its high heat performance and adhesive
properties this tape can also be use to attach
components to a vertical heatsink and to
metal enclosure surfaces.
Colour
Backing Type / Thickness
Adhesive Type / Thickness
Total Thickness
Adhesion
Thermal Conductivity
Thermal Resistance
Holding Power@23°C
Holding Power @ 130°C
-
Mm
Mm
mm
Kg/25mm
W/m-K
°C-in /W
Hour
Hour
2
White
Aluminium Foil / 0.10
Arylic 0.075 (on clear liner side)
0,27
1,5
0,95
0,2
>72
>2