EEWORLDEEWORLDEEWORLD

Part Number

Search

ECCM7PA08-35.328MTR

Description
QUARTZ CRYSTAL RESONATOR, 35.328MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
CategoryPassive components    Crystal/resonator   
File Size154KB,5 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Environmental Compliance  
Download Datasheet Parametric View All

ECCM7PA08-35.328MTR Overview

QUARTZ CRYSTAL RESONATOR, 35.328MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

ECCM7PA08-35.328MTR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerECLIPTEK
package instructionROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Codecompliant
Other featuresAT-CUT CRYSTAL; TAPE AND REEL
Ageing3 PPM/YEAR
Crystal/Resonator TypePARALLEL - FUNDAMENTAL
Drive level100 µW
frequency stability0.0015%
frequency tolerance10 ppm
JESD-609 codee4
load capacitance8 pF
Manufacturer's serial numberECCM7
Installation featuresSURFACE MOUNT
Nominal operating frequency35.328 MHz
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
physical sizeL3.2XB2.5XH0.8 (mm)/L0.126XB0.098XH0.031 (inch)
Series resistance60 Ω
surface mountYES
Terminal surfaceNickel/Gold (Ni/Au)

ECCM7PA08-35.328MTR Preview

ECCM7PA08-35.328M TR
Series
RoHS Compliant (Pb-free) 2.5mm x 3.2mm Ceramic
SMD Crystal
Frequency Tolerance/Stability
±10ppm at 25°C, ±15ppm over -20°C to +70°C
Mode of Operation
AT-Cut Fundamental
RoHS
Pb
Packaging Options
Tape & Reel
ECCM7 P A 08 -35.328M TR
Nominal Frequency
35.328MHz
Load Capacitance
8pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Crystal Cut
Spurious Response
Storage Temperature Range
Insulation Resistance
35.328MHz
±10ppm at 25°C, ±15ppm over -20°C to +70°C
±3ppm/Year Maximum
8pF Parallel Resonant
5pF Maximum
60 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum
AT-Cut
>3dB (from Fo to Fo +5000ppm)
-40°C to +85°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
2.50
±0.10
MARKING
ORIENTATION
0.70 ±0.10
4
1
1.20
±0.10
3
2
0.90 ±0.10
(X4)
2
1.00
±0.10
(X4)
3
4
LINE MARKING
1
2
E35.3
E=Ecliptek Designator
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
3.20
±0.10
0.80 MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 1 of 5
ECCM7PA08-35.328M TR
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.3 (X4)
1.3 (X4)
0.8
Solder Land
(X4)
0.4
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 2 of 5
ECCM7PA08-35.328M TR
Tape & Reel Dimensions
Quantity Per Reel: 3,000 units
4.0 ±0.1
2.00 ±0.05
DIA 1.5 ±0.2
0.20 ±0.05
3.5 ±0.1
8.0 ±0.2
2.75 ±0.10
3.6
±0.1
4.0 ±0.1
*Compliant to EIA 481A
2.9 ±0.1
1.0 ±0.1
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
14.4 MAX
360 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
8.4 +1.5/-0.0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 3 of 5
ECCM7PA08-35.328M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 4 of 5
ECCM7PA08-35.328M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 245°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 5 of 5
BB Black Basics: Eclipse C++ Control LED Lights (Part 1)
[i=s]This post was last edited by lonerzf on 2014-1-12 16:56[/i] Because the proposal report is not finished yet, I have to delay it for a few days. Today I will make an additional post and continue w...
lonerzf DSP and ARM Processors
DJI Drone Phantom 3 remote control transmits frequency hopping signal
I want to ask what mode the frequency hopping signal transmitted by the remote control is....
btty038 RF/Wirelessly
How can I use the WAVEINOPEN API functions to record audio data as a raw PCM file (uncompressed, unprocessed)? I can't find any on the Internet, only examples of recording as a WAV file
How can I record audio data into a raw PCM file (uncompressed, unprocessed) through the API functions of WAVEINOPEN? I couldn't find any on the Internet, only examples of recording into WAV files! //-...
liwei5613 Embedded System
How to send dual audio in single chip microcomputer
Hello everyone, how to send dual audio in a single chip microcomputer? What is the difference and connection between sending dual audio and sending single audio? I am making an alarm now, a host recei...
wangdong_wind Embedded System
Thoughts on making infrared sensor modules
Since it was my first time to make an infrared sensor, I searched for several circuits on the Internet and found many problems. I would like to share them with you. The first problem is whether the de...
wulei19880906 Test/Measurement
How do you test the performance of wince drivers?
I used to only know how to write some small programs for MCUs, but now I find that I don't know how to test the performance of drivers. I think wince drivers are similar to win32 drivers. How should t...
farmerhou Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1373  929  16  1127  897  28  19  1  23  34 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号