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M5M5258DP-20

Description
Standard SRAM, 64KX4, 20ns, CMOS, PDIP24, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-24
Categorystorage    storage   
File Size165KB,5 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric Compare View All

M5M5258DP-20 Overview

Standard SRAM, 64KX4, 20ns, CMOS, PDIP24, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-24

M5M5258DP-20 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMitsubishi
Parts packaging codeDIP
package instructionDIP, DIP24,.3
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time20 ns
Other featuresPOWER-DOWN; TTL COMPATIBLE INPUTS/OUTPUTS
I/O typeCOMMON
JESD-30 codeR-PDIP-T24
JESD-609 codee0
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of ports1
Number of terminals24
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX4
Output characteristics3-STATE
ExportableNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum standby current0.01 A
Minimum standby current2 V
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

M5M5258DP-20 Related Products

M5M5258DP-20 M5M5258DJ-20
Description Standard SRAM, 64KX4, 20ns, CMOS, PDIP24, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-24 Standard SRAM, 64KX4, 20ns, CMOS, PDSO24, 0.300 INCH, 1.27 MM PITCH, PLASTIC, SOJ-24
Is it Rohs certified? incompatible incompatible
Maker Mitsubishi Mitsubishi
Parts packaging code DIP SOJ
package instruction DIP, DIP24,.3 SOJ, SOJ24,.34
Contacts 24 24
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum access time 20 ns 20 ns
Other features POWER-DOWN; TTL COMPATIBLE INPUTS/OUTPUTS POWER-DOWN; TTL COMPATIBLE INPUTS/OUTPUTS
I/O type COMMON COMMON
JESD-30 code R-PDIP-T24 R-PDSO-J24
JESD-609 code e0 e0
memory density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
memory width 4 4
Number of functions 1 1
Number of ports 1 1
Number of terminals 24 24
word count 65536 words 65536 words
character code 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 64KX4 64KX4
Output characteristics 3-STATE 3-STATE
Exportable NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOJ
Encapsulate equivalent code DIP24,.3 SOJ24,.34
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum standby current 0.01 A 0.01 A
Minimum standby current 2 V 2 V
Maximum slew rate 0.12 mA 0.12 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 1.27 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
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