CD4541BD datasheet, PDF - EEWORLD Datasheet

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CD4541BD: DescriptionAnalog Waveform Generation Function, CMOS, CDIP14,; CategoryAnalog mixed-signal IC The signal circuit; File Size265KB，4 Pages; ManufacturerRCA

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CD4541BD Overview

Analog Waveform Generation Function, CMOS, CDIP14,

CD4541BD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	RCA
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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CD4541BD Related Products

	CD4541BD	CD4541BF	CD4541BFX	CD4541BF/3A	CD4541BEX	CD4541BEX98	CD4541BE98
Description	Analog Waveform Generation Function, CMOS, CDIP14,	Analog Waveform Generation Function, CMOS, CDIP14,	Analog Waveform Generation Function, CMOS, CDIP14,	Analog Waveform Generation Function, CMOS, CDIP14	Analog Waveform Generation Function, CMOS, PDIP14,	Analog Waveform Generation Function, CMOS, PDIP14,	Analog Waveform Generation Function, CMOS, PDIP14,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	RCA	RCA	RCA	RCA	RCA	RCA	RCA
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	R-PDIP-T14	R-PDIP-T14	R-PDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	-	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Certification status	Not Qualified	Not Qualified	-	Not Qualified	-	-	Not Qualified
Is Samacsys	-	N	N	N	N	N	N
Base Number Matches	-	1	1	1	1	1	1

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