IC,BUFFER/DRIVER,DUAL,4-BIT,BICMOS-TTL,FP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| package instruction | DFP, FL20,.3 |
| Reach Compliance Code | compliant |
| Control type | ENABLE LOW |
| JESD-30 code | R-XDFP-F20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.064 A |
| Number of digits | 4 |
| Number of functions | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Output polarity | INVERTED |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL20,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Maximum supply current (ICC) | 69 mA |
| Prop。Delay @ Nom-Sup | 5.6 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| 74BCT240FC | 74BCT240SCQR | 74BCT240DC | 74BCT240DCQR | 74BCT240FCQR | 74BCT240LCQR | 74BCT240LC | 74BCT240PCQR | |
|---|---|---|---|---|---|---|---|---|
| Description | IC,BUFFER/DRIVER,DUAL,4-BIT,BICMOS-TTL,FP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,BICMOS-TTL,SOP,20PIN,PLASTIC | IC,BUFFER/DRIVER,DUAL,4-BIT,BICMOS-TTL,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,BICMOS-TTL,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,BICMOS-TTL,FP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,BICMOS-TTL,LLCC,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,BICMOS-TTL,LLCC,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,BICMOS-TTL,DIP,20PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DIP, DIP20,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 code | R-XDFP-F20 | R-PDSO-G20 | R-XDIP-T20 | R-XDIP-T20 | R-XDFP-F20 | S-XQCC-N20 | S-XQCC-N20 | R-PDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A |
| Number of digits | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DFP | SOP | DIP | DIP | DFP | QCCN | QCCN | DIP |
| Encapsulate equivalent code | FL20,.3 | SOP20,.4 | DIP20,.3 | DIP20,.3 | FL20,.3 | LCC20,.35SQ | LCC20,.35SQ | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| Package form | FLATPACK | SMALL OUTLINE | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 69 mA | 69 mA | 69 mA | 69 mA | 69 mA | 69 mA | 69 mA | 69 mA |
| Prop。Delay @ Nom-Sup | 5.6 ns | 5.6 ns | 5.6 ns | 5.6 ns | 5.6 ns | 5.6 ns | 5.6 ns | 5.6 ns |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO | YES | YES | YES | NO |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | GULL WING | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL |
| Maker | National Semiconductor(TI ) | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |