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GS1B-L-TP

Description
1A, 100V, SILICON, SIGNAL DIODE, DO-214AC, ROHS COMPLIANT, PLASTIC, SMA, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size253KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance  
Download Datasheet Parametric View All

GS1B-L-TP Overview

1A, 100V, SILICON, SIGNAL DIODE, DO-214AC, ROHS COMPLIANT, PLASTIC, SMA, 2 PIN

GS1B-L-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AC
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codecompliant
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1 V
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Maximum non-repetitive peak forward current30 A
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current1 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum repetitive peak reverse voltage100 V
surface mountYES
Terminal surfaceMatte Tin (Sn)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature10
MCC
Micro Commercial Components
TM
  omponents
20736
Marilla
Street Chatsworth

  !"#
$ %    !"#
GS1A-L
THRU
GS1M-L
1.0 Amp Glass
Passivated Rectifier

50 to 1000 Volts

DO-214AC

(SMA) (LEAD

FRAME)
H

J
Features
Halogen
free available upon request by adding suffix "-HF"
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Extremely Low Thermal Resistance
High Temp Soldering: 260°C for 10 Seconds At Terminals
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Maximum Ratings
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Maximum Thermal Resistance; 15
°C/W
Junction To Lead
MCC
Catalog
Number
GS1A-L
GS1B-L
GS1D-L
GS1G-L
GS1J-L
GS1K-L
GS1M-L
Device
Marking
GS1A
GS1B
GS1D
GS1G
GS1J
GS1K
GS1M
Maximum
Reccurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
DIM
A
B
C
D
E
F
G
H
J
A
C
E
F
G
DIMENSIONS
INCHES
MIN
.079
.050
---
---
.030
.065
.189
.157
.090
D
B
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Typical Junction
Capacitance
I
F(AV)
I
FSM
1.0A
30A
T
L
= 110°C
8.3ms, half sine,
I
FM
= 1.0A;
T
J
= 25°C*
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MM
MIN
2.00
1.27
---
---
.76
1.65
4.80
4.00
2.25
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
V
F
1.0V
SUGGESTED SOLDER
PAD LAYOUT
0.090”
I
R
C
J
10µA
50µA
15pF
T
J
= 25°C
T
J
= 125°C
Measured at
1.0MHz, V
R
=4.0V
0.085”
*Pulse test: Pulse width 300
µsec,
Duty cycle 2%
Note 1: High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
0.070”
Revision:
E
www.mccsemi.com
1 of 4
2013/08/20
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