BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
●COMMODITY：AXIAL
TYPE LED
●DEVICE
NUMBER：BL-XE1361-TR9
●ELECTRICAL
AND OPTICAL CHARACTERISTICS (Ta=25℃)
Chip
Emitted
Color
Hi-Eff Red
Absolute Maximum
Rating
PAGE:
REVISION:
Electro-optical
Data (At 20mA)
2
1.0
Viewing
Angle
2θ1/2
(deg)
35
Lens
Peak
Dominant
Wave
Wave
Vf(V)
Iv(mcd)
If
Peak
Length
Length Appearance
Δλ
Pd
(nm) (mW) (mA) If(mA) Typ. Max. Min. Typ.
λP(nm) λd(nm)
640
628±5
Water Clear
40
80
30
100
2.0
2.6
18.5 40.0
Remark：1.Viewing angle is the Off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. This product doesn’t contain restriction substance ,comply ROHS standard
●ABSOLUTE
MAXIMUN RATINGS (Ta=25℃)
Reverse Voltage ………………………………………..……………………………….…..……………………….… 5V
Reverse Current (V
R
=5V) …………………………………………….………………………………………….. 100µA
Operating Temperature Range ……………………………………………..……….……………..…… -25℃
〜
80℃
Storage Temperature Range ……………………………………………………………………..…… -30℃
〜
85℃
Preheating Temperature ………………………………..……………..………….… 100℃
~
150℃ Within 2 Minutes
Soldering Temperature ………………………………..……………..………..…… 240℃
~
250℃ Within 5 Seconds
●PACKAGE
DIMENSIONS
NOTES: 1.All dimensions are in millimeters (inches).
2.Tolerance is
±
0.25mm (0.01”) unless otherwise specified.
3.Specifications are subject to change without notice.
BRIGHT LED ELECTRONICS CORP.
LED
LAMP SPECIFICATION
PAGE:
REVISION:
3
1.0
●COMMODITY：AXIAL
TYPE LED LAMP
●DEVICE
NUMBER：BL-XE1361-F9
BRIGHT LED ELECTRONICS CORP.
AXIAL LED LAMP SPECIFICATION
●COMMODITY：AXIAL
TYPE LED LAMP
●DEVICE
NUMBER：BL-XE1361-TR9
●TAPPING
AND PACKAGING SPECIFICATION
ITEM
SYMBOL
mm
Tape Feed Hole Diameter (DIA)
Feed Hole Location
Centers Line Dimensions Length Direction
Compartment Depth
Carrier Tape Overall Thickness
Compartment Pitch
Sprocket Hole Diameter
Centers Line Dimensions Length Direction
Carrier Tape Thickness
Carrier Tape Width
Flange Diameter
Hub Spindle Hole
Hub Diameter
Fixing Tape Width
Flange Space Between Flanges
Compartment Length
Compartment Width
D
0
E
F
K
0
K
P
P
0
P
2
t
W
A
C
D
2
W
1
T
A
0
B
0
1.40
1.65
5.45
3.00
3.00
3.90
3.90
1.95
－
12.00
178.0
12.50
20.00
9.00
16.00
1.87
6.30
Minimum
inch
0.055
0.065
0.215
0.118
0.118
0.153
0.153
0.076
－
0.472
7.008
0.492
0.788
0.354
0.629
0.074
0.248
mm
1.55
1.85
5.55
3.20
3.20
4.10
4.10
2.05
0.30
12.30
180.0
13.50
21.50
9.30
17.00
2.07
6.50
PAGE:
SPECIFICATION
Maximum
inch
0.061
0.072
0.218
0.126
0.126
0.161
0.161
0.080
0.012
0.484
7.087
0.531
0.846
0.366
0.669
0.081
0.256
4
REVISION: 1.0
A n o d e
C a t h o d e
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
RELIABILITY TEST
Test Item
Reference Standard
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS C 7021 :B-1
High
Temperature MIL-STD-202:103B
High Humidity JIS C 7021
:B-11
Endurance
Storage
Test
High
MIL-STD-883:1008
Temperature
JIS C 7021 :B-10
Storage
Low
Temperature JIS-C-7021 :B-12
Storage
Temperature MIL-STD-202:107D
Cycling
MIL-STD-750:1051
MIL-STD-883:1010
JIS C 7021 :A-4
Thermal Shock MIL-STD-202:107D
Environmental
MIL-STD-750:1051
Test
MIL-STD-883:1011
Solder
MIL-STD-202:201A
Resistance
MIL-STD-750:2031
JIS C 7021 :A-1
Classification
PAGE:
REVISION:
5
1.0
Result
0/20
Test Conditions
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
Ta=+65℃
±
5℃
RH=90%-95%
Test time=240hrs
High Ta=+85℃
±
5℃
Test time=1,000hrs
Low Ta=-35℃
±
5℃
Test time=1,000hrs
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min
60min
20min
Test Time=5cycle
-35℃
±
5℃ ~+85℃
±
5
℃
20min
20min
Test Time=10cycle
Preheating：
140℃-160℃,within 2 minutes.
Operation heating：
235℃(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
0/20
0/20
0/20
JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY
Measuring items
Forward voltage
Reverse current
Luminous intensity
Note:
Symbol
V
F
( V)
Ir(uA)
Iv ( mcd )
Measuring conditions
If=20mA
Vr=5V
If=20mA
Judgement criteria for failure
Over Ux1.2
Over Ux2
Below SX0.5
S means initial value.
1.U means the upper limit of specified characteristics.
ambient conditions after completion of each test.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
PAGE:
REVISION:
1.
SOLDERING:
6
1.0
●
Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
●
Reflow Soldering
Preheating : 140℃~160℃
±
5℃,within 2 minutes.
Operation heating : 235℃(MAX.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
●
DIP soldering (Wave Soldering)
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃
±
5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
TEMPERATURE
TEMPERATURE
140~160℃
235℃ MAX.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
TIME
Soldering heat Max. 260
℃
120~150℃
245
±5℃
within 5 sec.
Preheat
120~180 sec.
TIME
2.
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article
such as the sand blast and the metal hook.
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