oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
■
■
■
■
■
Applications
■
■
■
Lead free versions available
RoHS compliant (lead free version)*
Multiple resistors tied to a common node
Stable thin-film-on-silicon technology
Ultra-miniature packages to JEDEC
standards
Bus termination
Pull-up/pull-down
Ideal for space-constrained applications
*R
Thin Film on Silicon 2QSP / 2NBS-XX2 Bussed Resistors
General Information
Package Schematic
Bussed Resistor networks are typically used in DC pull-up
and pull-down applications where system data or control lines
must be tied to a fixed potential. Fabricated with a Tantalum
Nitride and Nickel Chromium on Silicon process, these
resistors feature excellent stability, TCR and tracking
performance. Bussed Resistor Networks are available in a
range of miniature package types conforming to JEDEC
standards.
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
Electrical & Environmental Characteristics
Electrical Characteristics
Resistance Range
Tolerance:
Absolute
Ratio
TCR:
Absolute
Tracking
Operating Voltage
Symbol
R
Minimum
100
±0.5 %
±0.1 %
Nominal
Maximum
100 K
±5 %
±2 %
Unit
Ω
Ω
Ω
ppm/°C
ppm/°C
V
V
100
150
25
50
Environmental Characteristics
ESD
Operating Temperature
Storage Temperature
Power Rating per Resistor @ 70 °C
Power Rating per Package @ 70 °C:
QSOP:
16 Pin
20, 24 Pin
28 Pin
NBSOIC: 8 Pin
14, 16 Pin
TJ
Tstg
2K
-55
-65
+125
+150
0.1
0.75
1.00
1.12
0.60
1.00
°C
°C
Watt
Watt
Watt
Watt
Watt
Watt
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
Mechanical Characteristics
QSOP Package Dimensions
A
.635
TYP.
(.025)
3.81 - 3.99
(.150 - .157)
Narrow-Body SOIC Package Dimensions
A
1.27
TYP.
(.050)
3.81 - 3.99
(.150 - .157)
PIN 1
.21 - .31
(.008 - .012)
1.35 - 1.75
(.053 - .069)
PIN 1
0.36 - 0.46
(.014 - .018)
1.35 - 1.75
(.053 - .069)
.10 - .25
(.004 - .010)
.10 - .25
(.004 - .010)
0-8
°
0-8
°
.19 - .25
(.007 - .010)
5.80 - 6.20
(.228 - .244)
.19 - .25
(.007 - .010)
.41 - 1.27
(.016 - .050)
5.80 - 6.20
(.228 - .244)
.41 - 1.27
(.016 - .050)
Model
2QSP16
2QSP20
2QSP24
2QSP28
4.80
8.56
8.56
9.80
-
-
-
-
A
4.98 (.189
8.74 (.337
8.74 (.337
9.98 (.386
-
-
-
-
.196)
.344)
.344)
.393)
Model
2NBS08
2NBS14
2NBS16
A
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
QSOP Package Power Temperature Derating Curve
Narrow-Body SOIC Package Power Temperature Derating Curve
1.25
WATTS
1.0
.75
.50
.25
0
2QSP28
2QSP20, 2QSP24
2QSP16
1.0
WATTS
.8
.6
.4
.2
2NBS14, 2NBS16
2NBS08
25
125
150
AMBIENT TEMPERATURE (
°
C )
50
75
100
0
25
50
75
100
125
150
°
C )
AMBIENT TEMPERATURE (
Schematic
Standard Resistance Values
Resistance
(ohms)
100
120
220
270
330
390
470
510
680
1K
1.5 K
2K
2.2 K
2.7 K
3.3 K
4.7 K
5.1 K
10 K
20 K
27 K
47 K
51
75
82
100
K
K
K
K
Resistance
Code
101
121
221
271
331
391
471
511
681
102
152
202
222
272
332
472
512
103
203
273
473
513
753
823
104
R2
R4
R6
R8
R10
R12
R14
R16
R18
R20
R22
R24
R26
R1
R3
R5
R7
R9
R11
R13
R15
R17
R19
R21
R23
R25
R27
8 PIN
14 PIN
16 PIN
20 PIN
24 PIN
28 PIN
Typical Part Marking
Represents total content. Layout may vary.
PIN COUNT
MODEL
CIRCUIT
PIN 1 INDICATOR
(MOLDED INDENT)
MANUFACTURER'S
TRADEMARK
QSP16J
2-103
YYWW
GRADE
RESISTANCE
CODE
DATE CODE
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
Dispensing
For large quantities, the product will be dispensed in Tape and Reel (see diagram below).
A0
DIMENSIONS = MM (INCHES)
B0
K0
Package
QSOP
16 Pin
20, 24 Pin
28 Pin
NBSOIC
8 Pin
14 Pin
16 Pin
A0
6.4 (0.252)
6.5 (0.256)
6.5 (0.256)
6.4 (0.252)
6.5 (0.256)
6.5 (0.256)
B0
5.2 (0.205)
9.0 (0.354)
10.3 (0.406)
9.0 (0.354)
9.0 (0.354)
9.0 (0.354)
K0
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
Width
12 (0.472)
16 (0.630)
16 (0.630)
12 (0.472)
16 (0.630)
16 (0.630)
Pitch
8 (0.315)
8 (0.315)
8 (0.315)
8 (0.315)
8 (0.315)
8 (0.315)
No. of Pieces No. of Pieces
per 13 ” reel
per tube
3,500
3,500
3,500
3,500
3,500
3,500
98
56
49
98
56
49
How To Order
2 QSP 20 - T J 2 - 472 __
Product Class
Thin-Film-on-Silicon
Standard Package Style
QSP = QSOP
NBS = Narrow-Body SOIC
Pin Count
QSP = 16, 20, 24, 28
NBS = 8, 14, 16
Dispensing
R = Reel
T = Tube
Standard Grade
Tolerance
J=
±5 %
G=
±2 %
F=
±1 %
Circuit
2 = Bussed
Resistance Value Code
1st two digits are significant,
3rd digit = number of zeros to follow to give resistance value in ohms.
Terminations
LF = 100 % Sn (lead free)
Blank = Sn/Pb
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
04/05
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
京公网安备 11010802033920号
EEWORLD
