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L64500BGMC

Description
RISC Microprocessor, 16-Bit, 25MHz, CMOS, CPGA144,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,29 Pages
ManufacturerLSC/CSI
Websitehttps://lsicsi.com
Download Datasheet Parametric Compare View All

L64500BGMC Overview

RISC Microprocessor, 16-Bit, 25MHz, CMOS, CPGA144,

L64500BGMC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLSC/CSI
Parts packaging codePGA
package instructionPGA, PGA144,15X15
Contacts144
Reach Compliance Codecompliant
bit size16
JESD-30 codeS-XPGA-P144
JESD-609 codee0
Number of terminals144
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codePGA
Encapsulate equivalent codePGA144,15X15
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
speed25 MHz
Maximum slew rate100 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

L64500BGMC Related Products

L64500BGMC L64500AGMC L64500GMC
Description RISC Microprocessor, 16-Bit, 25MHz, CMOS, CPGA144, RISC Microprocessor, 16-Bit, 20MHz, CMOS, CPGA144, RISC Microprocessor, 16-Bit, 15MHz, CMOS, CPGA144,
Is it Rohs certified? incompatible incompatible incompatible
Maker LSC/CSI LSC/CSI LSC/CSI
Parts packaging code PGA PGA PGA
package instruction PGA, PGA144,15X15 PGA, PGA144,15X15 PGA, PGA144,15X15
Contacts 144 144 144
Reach Compliance Code compliant compliant compliant
bit size 16 16 16
JESD-30 code S-XPGA-P144 S-XPGA-P144 S-XPGA-P144
JESD-609 code e0 e0 e0
Number of terminals 144 144 144
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC CERAMIC
encapsulated code PGA PGA PGA
Encapsulate equivalent code PGA144,15X15 PGA144,15X15 PGA144,15X15
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
speed 25 MHz 20 MHz 15 MHz
Maximum slew rate 100 mA 100 mA 100 mA
Nominal supply voltage 5 V 5 V 5 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form PIN/PEG PIN/PEG PIN/PEG
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location PERPENDICULAR PERPENDICULAR PERPENDICULAR
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
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