19-2077; Rev 4; 3/05
-100V, SOT23/TDFN, Simple Swapper
Hot-Swap Controllers
General Description
The MAX5900/MAX5901 are SOT23/TDFN hot-swap con-
trollers that allow a circuit card to be safely hot-plugged
into a live backplane without causing a glitch on
the power-supply rail. These devices operate from -9V to
-100V and provide the simplest hot-swap solution by
eliminating all external components except an external
n-channel MOSFET.
The MAX5900/MAX5901 limit the inrush current to the
load and provide a circuit-breaker function for overcurrent
protection. During startup, the circuit-breaker function is
disabled and the MAX5900/MAX5901 limit the inrush cur-
rent by gradually turning on the external MOSFET. Once
the external MOSFET is fully enhanced, the circuit-break-
er function is enabled and the MAX5900/MAX5901 pro-
vide overcurrent protection by monitoring the voltage
drop across the external MOSFET’s on-resistance.
The MAX5900/MAX5901 include an undervoltage lock-
out (UVLO) function, ON/OFF control input, and a power-
good status output,
PGOOD
(MAX5900) or PGOOD
(MAX5901). A built-in thermal shutdown feature is also
included to protect the external MOSFET in case of over-
heating.
The MAX5900/MAX5901 offer latched or autoretry fault
management and are available with 200mV, 300mV, or
400mV circuit-breaker thresholds. Both the MAX5900 and
MAX5901 are available in small SOT23 and TDFN pack-
ages, and are specified for the extended -40°C to +85°C
temperature range. For specific ordering information see
the
Selector Guide
at the end of the data sheet.
o
Wide -9V to -100V Operation
o
Requires No External Sense Resistor
o
Drives External N-Channel MOSFET
o
Limits Inrush Current
o
Circuit-Breaker Function
o
Less than 1mA Quiescent Current
o
ON/OFF Input Permits Load Power-Supply
Control and Sequencing
o
Adjustable Undervoltage Lockout
o
Power-Good Output with 100V Rating
o
Latching or Automatic Retry Fault Management
o
Thermal Shutdown Helps Protect the External
MOSFET
o
Space-Saving 6-Pin SOT23 and TDFN Packages
Features
MAX5900/MAX5901
Ordering Information
PART
MAX5900_
_EUT-T*
MAX5900_ _ETT-T*
MAX5901_
_EUT-T*
MAX5901_ _ETT-T*
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
6 SOT23-6
6 TDFN-6-EP**
6 SOT23-6
6 TDFN-6-EP**
_________________________Applications
Telecom Line Cards
Network
o
Requires No External Sense Resistor
Switches
Network Routers
Servers
Base-Station Line
Cards
*For
specific part numbers, see Selector Guide at end of data
sheet.
**EP
= Exposed pad.
Pin Configurations
TOP VIEW
V
EE
1
6
ON/OFF
Typical Operating Circuits
BACKPLANE CIRCUIT CARD
GND
HOT-SWAP CONTROLLER
V
1
+
MAX5900
GND
ON/OFF
V
EE
PGOOD
DRAIN
GATE
V
1
-
LUCENT
JWO50A1
ON/OFF
50W ISOLATED
POWER SUPPLY
DRAIN
2
MAX5900
MAX5901
5
PGOOD (PGOOD)
GATE
3
4
GND
SOT23
( ) ARE FOR MAX5901 ONLY.
Pin Configurations continued at end of data sheet.
Typical Operating Circuits continued at end of data sheet.
Simple Swapper is a trademark of Maxim Integrated Products, Inc.
-48V
FUSE
IRF540NS
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
-100V, SOT23/TDFN, Simple Swapper
Hot-Swap Controllers
MAX5900/MAX5901
ABSOLUTE MAXIMUM RATINGS
Terminal Voltage (with respect to GND, unless otherwise noted)
V
EE,
DRAIN, PGOOD,
PGOOD
............................-120V to +0.3V
ON/OFF to V
EE
.........................................................-0.3V to +4V
GATE to V
EE
......................................................... -0.3V to +12V
Current into Any Pin............................................................±3mA
Continuous Power Dissipation (T
A
= +70°C)
6-Pin SOT23 (derate 9.1mW/°C above +70°C)...........727mW
6-Pin TDFN (derate 18.2mW/°C above +70°C) ........1454mW
Junction to Case Thermal Resistance,
θ
JC
(TDFN) ........8.5°C/W
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature...........................................................(Note 1)
Note 1:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of solder profiles recom-
mended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Pre-
heating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
EE
= -9V to -100V, GND = 0V, ON/OFF open circuit, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
EE
= -48V
and T
A
= +25°C.) (Notes 2, 3)
PARAMETER
Supply Voltage
Supply Current
External Gate Drive
Load Voltage Slew-Rate
Magnitude
Default UVLO
UVLO Hysteresis
ON/OFF Input Resistance
Drain to V
EE
Resistance
ON/OFF Reference
Threshold
ON/OFF Hysteresis
Start Delay (Note 4)
ON/OFF Off Delay (Note 5)
Circuit-Breaker
Threshold
t
ON
t
OFF
V
CB
V
GATE
- V
EE
< 1V
MAX590_ _AEUT
V
DRAIN
- V
EE
(V
DRAIN
- V
EE
) > V
CB
until (V
GATE
- V
EE
) <
1V, 200mV overdrive
step
MAX590_ _BEUT
MAX590_ _CEUT
C
GATE
= 1nF
C
GATE
= 4.7nF
C
GATE
= 10nF
150
Circuit-Breaker Delay
(Note 6)
Restart Delay (Note 4)
150
9
170
265
365
R
ON/OFF
R
DVEE
V
ON/OFF
(V
ON/OFF
- V
EE
) increasing
1.14
20
SYMBOL
V
EE
I
GND
V
GS
Measured at GND
V
EE
= -36V to -72V
V
GATE
- V
EE
V
EE
= -100V
V
EE
= -9V
SR
V
UVLO
| dV
DRAIN
/dt |, C
LOAD
= 10µF, V
EE
= -9V to -36V
|V
EE
| increasing
7.5
8
6
4.5
-34.5
CONDITIONS
MIN
-100
0.5
9.5
10
7
10
-31.5
3.5
32
466
1.26
140
300
20
200
300
400
1.5
2.5
4
300
500
32
240
345
455
3
4.5
6
500
ms
µs
mV
1.38
50
17
-28.5
V/ms
V
V
kΩ
kΩ
V
mV
ms
ms
TYP
MAX
-9
1.3
11.6
11.6
V
UNITS
V
mA
t
CB
t
RS
After circuit-breaker event, MAX590_A_EUT only
2
_______________________________________________________________________________________
-100V, SOT23/TDFN, Simple Swapper
Hot-Swap Controllers
ELECTRICAL CHARACTERISTICS (continued)
(V
EE
= -9V to -100V, GND = 0V, ON/OFF open circuit, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
EE
= -48V
and T
A
= +25°C.) (Notes 2, 3)
PARAMETER
PGOOD
(PGOOD)
Assertion Threshold
(Note 7)
PGOOD
(PGOOD)
Output Low Voltage
Power-Good Output Open-
Drain Leakage Current
Thermal Shutdown
Temperature
Thermal Shutdown
Hysteresis
SYMBOL
V
PG
CONDITIONS
V
DRAIN
- V
EE;
MAX590_A,
MAX590_L only
MAX5900, V
PGOOD
- V
EE
, I
OL
= 1mA;
MAX5901, V
PGOOD
- V
EE
, I
OL
= 1mA
V
PGOOD
- V
EE
= 100V (MAX5900);
V
PGOOD
- V
EE
= 100V (MAX5901)
Junction temperature
MIN
TYP
0.75
✕
V
CB
MAX
UNITS
mV
MAX5900/MAX5901
V
OL
I
OH
T
SD
T
HY
0.6
0.2
+125
15
1.65
10
V
µA
°C
°C
Note 2:
All currents into device pins are positive, all currents out of device pins are negative, and all voltages are referenced to
GND, unless otherwise noted.
Note 3:
All specifications are 100% tested at T
A
= +25°C. Specifications over -40°C to +85°C are guaranteed by characterization.
Note 4:
This is the delay time from a valid on condition until V
GS
begins rising. Valid on conditions are: the device is not in undervolt-
age lockout; ON/OFF is not driven low; and the device is not in thermal shutdown.
Note 5:
This is the delay from a valid low on ON/OFF until V
GS
falls. Pulses on ON/OFF less than t
OFF
are ignored, offering glitch
immunity.
Note 6:
Guaranteed by design, not production tested.
Note 7:
For a detailed description, see the
Power-Good Output
section.
Typical Operating Characteristics
(V
EE
= -48V, GND = 0V, and T
A
= +25°C, unless otherwise noted. See Figure 6 for test circuits.)
SUPPLY CURRENT
vs. INPUT VOLTAGE
MAX5900/01 toc01
SUPPLY CURRENT vs. TEMPERATURE
MAX5900/1 toc02
DEFAULT UNDERVOLTAGE LOCKOUT
vs. TEMPERATURE
-25.5
-26.5
-27.5
-28.5
-29.5
-30.5
-31.5
-32.5
-33.5
-34.5
-35.5
-36.5
-37.5
DECREASING |V
EE
|
MAX9500/01 toc03
1.1
100kΩ FROM ON/OFF TO GND
1.0
SUPPLY CURRENT (mA)
0.9
0.90
0.85
0.80
I
EE
(mA)
0.75
0.70
V
EE
= -12V
0.65
V
EE
= -75V
V
EE
= -48V
V
UVLO
(V)
0.8
0.7
0.6
0.5
-100
-80
-60
-40
-20
0
INPUT VOLTAGE (V)
INCREASING |V
EE
|
0.60
0.55
-50
-25
0
25
50
75
100
125
TEMPERATURE (°C)
-50
-25
0
25
50
75
100
125
TEMPERATURE (°C)
_______________________________________________________________________________________
3
-100V, SOT23/TDFN, Simple Swapper
Hot-Swap Controllers
MAX5900/MAX5901
Typical Operating Characteristics (continued)
(V
EE
= -48V, GND = 0V, and T
A
= +25°C, unless otherwise noted. See Figure 6 for test circuits.)
GATE DRIVE VOLTAGE
vs. INPUT VOLTAGE
MAX5900/1 toc04
RESTART DELAY
vs. TEMPERATURE
MAX5900/01 toc05
STARTUP WAVEFORMS
(R
L
= 90Ω, C
L
= 100µF)
MAX5900/01 toc06
11.0
10.5
10.0
9.5
V
GS
(V)
9.0
8.5
8.0
7.5
7.0
-100
-80
-60
-40
-20
0
INPUT VOLTAGE (V)
450
400
350
t
RS
(ms)
300
250
A
0
0
B
0
C
0
200
150
-50
-25
0
25
50
75
100
125
TEMPERATURE (°C)
D
A: V
GS
, 5V/div
B: I
IN
, 1A/div
40ms/div
C: V
EE
, 50V/div
D: V
DRAIN
, 40V/div
STARTUP WAVEFORMS
R
L
= OPEN, C
L
= 10µF
MAX5900/1 toc07
STARTUP WAVEFORMS
R
L
= 40Ω, C
L
= 10µF
MAX5900/1 toc08
STARTUP WAVEFORMS
R
L
= 40Ω, C
L
= 100µF
A
0
0
B
MAX5900/1 toc09
A
0
0
B
A
0
0
B
0
C
0
C
0
C
0
D
5ms/div
A: V
GS,
10V/div
B: I
IN,
1A/div
C: V
OUT,
50V/div
D: PGOOD
,
50V/div
A: V
GS,
10V/div
B: I
IN,
1A/div
5ms/div
C: V
OUT,
50V/div
D: PGOOD
,
50V/div
D
0
5ms/div
A: V
GS,
10V/div
B: I
IN,
200mA/div
C: V
OUT,
50V/div
D: PGOOD
,
50V/div
D
CIRCUIT-BREAKER EVENT
(C
GATE
= 1000pF, V
OVERDRIVE
= 20mV)
MAX5900/1 toc10
CIRCUIT-BREAKER EVENT
(C
GATE
= 1000pF, V
OVERDRIVE
= 200mV)
MAX5900/1 toc11
SLEW RATE vs. V
EE
T
A
= +120°C
11
SLEW RATE (V/ms)
10
9
T
A
= +25°C
8
T
A
= -40°C
7
6
MAX5900/01 toc12
12
A
0
B
0
A
0
B
0
C
0
C
0
2µs/div
D: PGOOD
,
50V/div
B: V
DS
, 500mV/div
C: V
GS,
10V/div
D: PGOOD
,
50V/div
B: V
DS
, 500mV/div
2µs/div
C: V
GS,
10V/div
-100
-80
-60
-40
-20
0
V
EE
(V)
4
_______________________________________________________________________________________
-100V, SOT23/TDFN, Simple Swapper
Hot-Swap Controllers
Pin Description
PIN
MAX5900
1
MAX5901
1
NAME
V
EE
FUNCTION
Negative Supply Voltage Input and External n-Channel MOSFET Source
Connection
Drain Sense Input for External n-Channel MOSFET. Connect DRAIN as close as
possible to the MOSFET’s drain and use wide circuit traces to assure good
thermal coupling between the MAX5900/MAX5901 and the MOSFET (see the
Layout Guidelines
section).
Gate Drive Output for External n-Channel MOSFET
Ground Connection.
Power-Good Output.
PGOOD
is an n-channel, open-drain, active-low output,
referenced to V
EE
.
Power-Good Output. PGOOD is an n-channel, open-drain, active-high output,
referenced to V
EE
.
ON/OFF Control Input. ON/OFF is referenced to V
EE
. Drive ON/OFF above 1.38V
or leave unconnected to enable the device. Drive ON/OFF below 1V to disable
the device. ON/OFF is also used to adjust the UVLO threshold. See the
Under-
voltage Lockout
section in the
Applications Information.
Internally clamped to
nominally 3V through a 1kΩ resistor (see Figure 1).
Exposed Pad (TDFN only). Connect to V
EE
.
MAX5900/MAX5901
2
2
DRAIN
3
4
5
—
3
4
—
5
GATE
GND
PGOOD
PGOOD
6
6
ON/OFF
—
—
EP
Detailed Description
The MAX5900/MAX5901 are integrated hot-swap con-
troller ICs contained in 6-pin SOT23/TDFN packages.
They allow a board to be safely hot plugged into a live
backplane without causing a glitch on the power-sup-
ply rail. They are well suited for -48V telecom power
systems, allowing a cost-effective, simple, and com-
pact design. The MAX5900/MAX5901 operate from -9V
to -100V to cover the standard telecom voltage range,
and to serve more generalized applications. These
devices require only an external n-channel power MOS-
FET to provide hot-swap control. Figure 1 shows a
functional diagram of the MAX5900/MAX5901.
The MAX5900/MAX5901 control an external n-channel
power MOSFET placed in the negative power-supply
pathway. When power is first applied, the MAX5900/
MAX5901 keep the MOSFET turned off. The MAX5900/
MAX5901 hold the MOSFET off indefinitely if ON/OFF is
held low, if the supply voltage is below the undervolt-
age lockout level, or if the die temperature exceeds
+125°C. If none of these conditions exist for 300ms
(typ), the MAX5900/MAX5901 begin to gradually turn
on the MOSFET. During this turn-on phase, the
MAX5900/MAX5901 slowly enhance the MOSFET,
MAX5900
MAX5901
GND
828kΩ*
ON/OFF
1kΩ*
34.5kΩ*
3V
V
EE
V
EE
CONTROL
LOGIC
PGOOD
(PGOOD)
N
V
EE
466kΩ*
GATE
DRAIN
( ) ARE FOR THE MAX5901 ONLY.
*RELATIVE TOLERANCE
±1%,
ABSOLUTE TOLERANCE
±20%
TYPICAL.
Figure 1. Functional Diagram
5
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