3.2mm
×
2.8mm 0.5W
SMD Type
Package Dimensions:
All dimensions are in mm
Tolerance: ±0.25mm
Absolute Maximum Ratings at Ta=25°C
Parameter
LED Junction Temperature
Power Dissipation
Reverse Voltage
D.C. Forward Current
Pulsed Forward Current (1 / 10 Duty Cycle, 0.1ms Pulse Width)
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Electric Static Discharge Threshold (HBM)
Thermal Resistance Junction to Board (Heat Sink)
Symbol
Tj
P
d
V
r
If
If (Peak)
Topr.
Tstg.
Tsld.
ESD
RΦ
j
-
b
110
420
5
150
300
-40 to +75
-40 to +105
Rating
Unit
°C
mW
V
mA
mA
°C
°C
Reflow Soldering: 260°C for 10sec.
Hand Soldering: 350°C for 3sec.
6,000
26
V
°C/W
Electrical & Optical Characteristics:
Parameter
Luminous Flux*
Forward Voltage
Peak Wavelength
Dominant Wavelength
Reverse Current
Viewing Angle
Spectrum Line Halfwidth
Symbol
Φv
Vf
λp
λd
Ir
2Φ½
∆λ
Condition
If = 150mA
If = 150mA
If = 150mA
If = 150mA
Vr = 5V
If = 150mA
If = 150mA
Min.
3
-
-
-
-
-
-
Typ.
4
3.2
-
465
-
120
26
Max.
-
3.8
-
-
50
-
-
Unit
lm
V
nm
nm
µA
deg
nm
Note : *Luminous Flux os converted from Luminous Intensity.
1. The data is tested by an IS tester.
2. Customer’s special requirements are also welcome.
www.element14.com
www.farnell.com
www.newark.com
Page <1>
02/07/12
V1.0
3.2mm
×
2.8mm 0.5W
SMD Type
Recommended Storage Environment:
•
•
•
Temperature: 5°C to 30°C (41°F to 86°F)
Humidity: 60% RH Max.
Use within 7 days after opening of sealed vapour/ESD barrier bags
If moisture absorbent material (silica gel) has faded away or LEDs have exceeded the storage time, baking treatment should
be performed using the following conditions:
• Baking Treatment : 60 ± 5°C for 24 hours
• Fold the opened bag firmly and keep in dry environment
Soldering
Reflow Soldering
Lead Solder
Pre-heat
Pre-heat Time
Peak Temperature
Soldering Time
Condition
12°C ~ 150°C
120sec. max.
240°C max.
10sec max.
Refer to Temperature
Profile 1
Lead-free Solder
180°C ~ 200°C
120sec. max
260°C max.
10sec. max
Refer to Temperature
Profile 2
Soldering Time
3sec. Max
(one time only)
Temperature
350°C Max.
Hand Soldering
*After reflow soldering rapid cooling should be avoided.
Temperature-profile (surface of circuit board)
Use the conditions shown under figure.
Recommended Soldering Pad Design
Use the conditions shown under figure.
Part Number Table
LED Chip
Material
AlGaInP / Si
Emitting Colour
Yellow
Lens Colour
Water Clear
Part Number
703-1037
Important Notice :
This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.
www.element14.com
www.farnell.com
www.newark.com
Page <3>
02/07/12
V1.0
ADI Reference Circuit
京公网安备 11010802033920号
EEWORLD
