|
LMC8101MM/NOPB |
LMC8101MMX/NOPB |
LMC8101TPX/NOPB |
| Description |
IC OP-AMP, 7000 uV OFFSET-MAX, 0.84 MHz BAND WIDTH, PDSO8, MSOP-8, Operational Amplifier |
IC OP-AMP, 7000 uV OFFSET-MAX, 0.84 MHz BAND WIDTH, PDSO8, MSOP-8, Operational Amplifier |
IC OP-AMP, 7000 uV OFFSET-MAX, 0.84 MHz BAND WIDTH, PBGA8, LEAD FREE, MICRO, SMD-8, Operational Amplifier |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
| Maker |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| Parts packaging code |
SOIC |
SOIC |
BGA |
| package instruction |
TSSOP, TSSOP8,.19 |
TSSOP, TSSOP8,.19 |
FBGA, BGA8,3X3,20 |
| Contacts |
8 |
8 |
8 |
| Reach Compliance Code |
compliant |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Architecture |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
0.000064 µA |
0.000064 µA |
0.000064 µA |
| Nominal Common Mode Rejection Ratio |
87 dB |
87 dB |
87 dB |
| frequency compensation |
YES |
YES |
YES |
| Maximum input offset voltage |
7000 µV |
7000 µV |
7000 µV |
| JESD-30 code |
S-PDSO-G8 |
S-PDSO-G8 |
S-PBGA-B8 |
| JESD-609 code |
e3 |
e3 |
e1 |
| length |
3 mm |
3 mm |
1.412 mm |
| low-bias |
YES |
YES |
YES |
| low-dissonance |
NO |
NO |
NO |
| micropower |
NO |
NO |
NO |
| Humidity sensitivity level |
1 |
1 |
1 |
| Negative supply voltage upper limit |
-6 V |
-6 V |
-6 V |
| Nominal Negative Supply Voltage (Vsup) |
-5 V |
-5 V |
-5 V |
| Number of functions |
1 |
1 |
1 |
| Number of terminals |
8 |
8 |
8 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TSSOP |
TSSOP |
FBGA |
| Encapsulate equivalent code |
TSSOP8,.19 |
TSSOP8,.19 |
BGA8,3X3,20 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
| Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
GRID ARRAY, FINE PITCH |
| method of packing |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
| power |
NO |
NO |
NO |
| power supply |
2.7/+-5 V |
2.7/+-5 V |
2.7/+-5 V |
| Programmable power |
NO |
NO |
NO |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| minimum slew rate |
0.8 V/us |
0.8 V/us |
0.8 V/us |
| Nominal slew rate |
1.2 V/us |
1.2 V/us |
1.2 V/us |
| Maximum slew rate |
1.9 mA |
1.9 mA |
1.9 mA |
| Supply voltage upper limit |
6 V |
6 V |
6 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
GULL WING |
GULL WING |
BALL |
| Terminal pitch |
0.65 mm |
0.65 mm |
0.5 mm |
| Terminal location |
DUAL |
DUAL |
BOTTOM |
| Maximum time at peak reflow temperature |
40 |
40 |
NOT SPECIFIED |
| Nominal Uniform Gain Bandwidth |
840 kHz |
840 kHz |
840 kHz |
| Minimum voltage gain |
560 |
560 |
560 |
| broadband |
NO |
NO |
NO |
| width |
3 mm |
3 mm |
1.412 mm |
| Maximum seat height |
1.1 mm |
1.1 mm |
- |