AND Gate, TTL, CDIP14,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | compli |
| JESD-30 code | R-XDIP-T14 |
| Logic integrated circuit type | AND GATE |
| MaximumI(ol) | 0.02 A |
| Humidity sensitivity level | 2A |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| power supply | 5 V |
| Maximum supply current (ICC) | 9.7 mA |
| Prop。Delay @ Nom-Su | 7.5 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| 5962-01-182-1822 | 74F11PCQM | 5962-01-319-7922 | 74F11DCQM | |
|---|---|---|---|---|
| Description | AND Gate, TTL, CDIP14, | AND Gate, TTL, PDIP14, | AND Gate, TTL, CDIP14, | AND Gate, TTL, CDIP14, |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | compli | compliant | compliant | compli |
| JESD-30 code | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
| Logic integrated circuit type | AND GATE | AND GATE | AND GATE | AND GATE |
| Humidity sensitivity level | 2A | 2A | 2A | 2A |
| Number of terminals | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C | 70 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 |
| Maker | - | Fairchild | Fairchild | Fairchild |