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BQ51013YFFT

Description
Generation 2 Integrated Wireless Power Receiver Solution, Qi (Wireless Power Consortium) Compliant 28-DSBGA 0 to 125
CategoryWireless rf/communication    Telecom circuit   
File Size3MB,31 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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BQ51013YFFT Overview

Generation 2 Integrated Wireless Power Receiver Solution, Qi (Wireless Power Consortium) Compliant 28-DSBGA 0 to 125

BQ51013YFFT Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionVFBGA,
Contacts28
Reach Compliance Codecompli
Factory Lead Time1 week
Samacsys DescriptiTEXAS INSTRUMENTS - BQ51013YFFT - WIRELESS POWER RCVR, 28DSBGA
JESD-30 codeR-XBGA-B28
JESD-609 codee1
length2.76 mm
Humidity sensitivity level1
Number of functions1
Number of terminals28
Maximum operating temperature125 °C
Minimum operating temperature
Package body materialUNSPECIFIED
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height0.625 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelOTHER
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.4 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width1.56 mm

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Description Generation 2 Integrated Wireless Power Receiver Solution, Qi (Wireless Power Consortium) Compliant 28-DSBGA 0 to 125 Generation 2 Integrated Wireless Power Receiver Solution, Qi (Wireless Power Consortium) Compliant 28-DSBGA 0 to 125 Generation 2 Integrated Wireless Power Receiver Solution, Qi (Wireless Power Consortium) Compliant 28-DSBGA 0 to 125 Generation 2 Integrated Wireless Power Receiver Solution, Qi (Wireless Power Consortium) Compliant 28-DSBGA 0 to 125
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it Rohs certified? conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA BGA BGA BGA
package instruction VFBGA, VFBGA, VFBGA, VFBGA,
Contacts 28 28 28 28
Reach Compliance Code compli compli compli compli
Factory Lead Time 1 week 8 weeks 8 weeks 8 weeks
JESD-30 code R-XBGA-B28 R-XBGA-B28 R-XBGA-B28 R-XBGA-B28
JESD-609 code e1 e1 e1 e1
length 2.76 mm 2.76 mm 2.76 mm 2.76 mm
Humidity sensitivity level 1 1 1 1
Number of functions 1 1 1 1
Number of terminals 28 28 28 28
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code VFBGA VFBGA VFBGA VFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 0.625 mm 0.625 mm 0.625 mm 0.625 mm
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level OTHER OTHER OTHER OTHER
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL
Terminal pitch 0.4 mm 0.4 mm 0.4 mm 0.4 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 1.56 mm 1.56 mm 1.56 mm 1.56 mm
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