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LXP2181AJE

Description
Framer, CMOS, CDIP40,
CategoryWireless rf/communication    Telecom circuit   
File Size907KB,24 Pages
ManufacturerLevel One
Download Datasheet Parametric Compare View All

LXP2181AJE Overview

Framer, CMOS, CDIP40,

LXP2181AJE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLevel One
package instructionDIP, DIP40,.6
Reach Compliance Codeunknown
Carrier typeCEPT PCM-30/E-1
JESD-30 codeR-GDIP-T40
JESD-609 codee0
Number of functions1
Number of terminals40
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum slew rate10 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Telecom integrated circuit typesFRAMER
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

LXP2181AJE Related Products

LXP2181AJE LXP2181APE LXP2181ANE
Description Framer, CMOS, CDIP40, Framer, CMOS, PQCC44, Framer, CMOS, PDIP40,
Is it Rohs certified? incompatible incompatible incompatible
Maker Level One Level One Level One
package instruction DIP, DIP40,.6 QCCJ, LDCC44,.7SQ DIP, DIP40,.6
Reach Compliance Code unknown unknown unknown
Carrier type CEPT PCM-30/E-1 CEPT PCM-30/E-1 CEPT PCM-30/E-1
JESD-30 code R-GDIP-T40 S-PQCC-J44 R-PDIP-T40
JESD-609 code e0 e0 e0
Number of functions 1 1 1
Number of terminals 40 44 40
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP QCCJ DIP
Encapsulate equivalent code DIP40,.6 LDCC44,.7SQ DIP40,.6
Package shape RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE CHIP CARRIER IN-LINE
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum slew rate 10 mA 10 mA 10 mA
Nominal supply voltage 5 V 5 V 5 V
surface mount NO YES NO
technology CMOS CMOS CMOS
Telecom integrated circuit types FRAMER FRAMER FRAMER
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL QUAD DUAL
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