SRAM Module, 32KX16, 150ns, CMOS, PZIP40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | APTA Group Inc |
| package instruction | ZIP, ZIP40,.1 |
| Reach Compliance Code | unknown |
| Maximum access time | 150 ns |
| I/O type | COMMON |
| JESD-30 code | R-PZIP-T40 |
| JESD-609 code | e0 |
| memory density | 524288 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 16 |
| Number of terminals | 40 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 32KX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | ZIP |
| Encapsulate equivalent code | ZIP40,.1 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum standby current | 0.0001 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.075 mA |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.27 mm |
| Terminal location | ZIG-ZAG |
| MS1632ZKXLI-15 | MS1632ZKXLI-12 | MS1632ZKXL-15 | MS1632ZKXI-10 | MS1632ZKX-12 | MS1632ZKX-10 | MS1632ZKXI-15 | |
|---|---|---|---|---|---|---|---|
| Description | SRAM Module, 32KX16, 150ns, CMOS, PZIP40 | SRAM Module, 32KX16, 120ns, CMOS, PZIP40 | SRAM Module, 32KX16, 150ns, CMOS, PZIP40 | SRAM Module, 32KX16, 100ns, CMOS, PZIP40 | SRAM Module, 32KX16, 120ns, CMOS, PZIP40 | SRAM Module, 32KX16, 100ns, CMOS, PZIP40 | SRAM Module, 32KX16, 150ns, CMOS, PZIP40 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc |
| package instruction | ZIP, ZIP40,.1 | ZIP, ZIP40,.1 | ZIP, ZIP40,.1 | ZIP, ZIP40,.1 | ZIP, ZIP40,.1 | ZIP, ZIP40,.1 | ZIP, ZIP40,.1 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 150 ns | 120 ns | 150 ns | 100 ns | 120 ns | 100 ns | 150 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PZIP-T40 | R-PZIP-T40 | R-PZIP-T40 | R-PZIP-T40 | R-PZIP-T40 | R-PZIP-T40 | R-PZIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | -40 °C | - | - | -40 °C |
| organize | 32KX16 | 32KX16 | 32KX16 | 32KX16 | 32KX16 | 32KX16 | 32KX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | ZIP | ZIP | ZIP | ZIP | ZIP | ZIP | ZIP |
| Encapsulate equivalent code | ZIP40,.1 | ZIP40,.1 | ZIP40,.1 | ZIP40,.1 | ZIP40,.1 | ZIP40,.1 | ZIP40,.1 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| Minimum standby current | 2 V | 2 V | 2 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
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