Jbar-Kbar Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDIP24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | JBAR-KBAR FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 83300000 Hz |
| MaximumI(ol) | 0.048 A |
| Number of functions | 8 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 7.5 ns |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 6 |
| Trigger type | POSITIVE EDGE |
| IDT74FCT826BPQ | 54FCT826BLB | 74FCT826BTL | |
|---|---|---|---|
| Description | Jbar-Kbar Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDIP24 | Jbar-Kbar Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CQCC28 | Jbar-Kbar Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CQCC28 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant |
| JESD-30 code | R-PDIP-T24 | S-XQCC-N28 | S-XQCC-N28 |
| JESD-609 code | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | JBAR-KBAR FLIP-FLOP | JBAR-KBAR FLIP-FLOP | JBAR-KBAR FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 83300000 Hz | 83300000 Hz | 83300000 Hz |
| MaximumI(ol) | 0.048 A | 0.032 A | 0.048 A |
| Number of functions | 8 | 8 | 8 |
| Number of terminals | 24 | 28 | 28 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | QCCN | QCCN |
| Encapsulate equivalent code | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ |
| Package shape | RECTANGULAR | SQUARE | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 7.5 ns | 8.5 ns | 7.5 ns |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | QUAD |
| Maximum time at peak reflow temperature | 6 | NOT SPECIFIED | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Objectid | - | 1157440559 | 1157440998 |
| Certification status | - | Not Qualified | Not Qualified |
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