39-28-5206 datasheet, PDF - EEWORLD Datasheet

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39-28-5206: DescriptionBoard Connector, 20 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal, LEAD FREE; CategoryThe connector The connector; File Size126KB，1 Pages; ManufacturerMolex; Websitehttps://www.molex.com/molex/home; Environmental Compliance

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39-28-5206 Overview

Board Connector, 20 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal, LEAD FREE

39-28-5206 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Molex
package instruction	LEAD FREE
Reach Compliance Code	unknown
Other features	STANDARD: DIN 41654, QF 50, POLARIZED, SHROUDED, STACKABLE
Connector type	BOARD CONNECTOR
Contact to complete cooperation	TIN (39) OVER NICKEL
Contact completed and terminated	Tin (Sn) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	BRASS
DIN compliance	YES
Filter function	NO
IEC compliance	NO
JESD-609 code	e3
MIL compliance	NO
Manufacturer's serial number	5578
Plug information	MULTIPLE MATING PARTS AVAILABLE
Mixed contacts	NO
Installation method	RIGHT ANGLE
Installation type	BOARD
Number of rows loaded	2
Options	GENERAL PURPOSE
Terminal pitch	2.54 mm
Termination type	SOLDER
Total number of contacts	20
UL Flammability Code	94V-0

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2.54mm (.100") Pitch

QF-50

™

Shrouded Header

5576

Vertical

With Eject Levers

Features and Benefits

■

10 to 64 circuits

■

Tin plated on solder tail

■

Complies with industry standard DIN 41654

■

Polarized

■

Selective Gold plating options for contacts

■

Eject levers allow end-to-end stacking with or without

strain relief with no loss of board space

Reference Information

Packaging: Tray

Designed In: Millimeters

Mates With: 5320

Electrical

Voltage: 250V

Current: 1.0A

Contact Resistance: 20 milliohms max.

Dielectric Withstanding Voltage: 500V

Insulation Resistance: 1000 Megohms min.

Physical

Housing: Glass-filled PBTP

Contact: Brass

Operating Temperature: -40 to +105˚C

Circuits

Order No.

Plating NBGS1

39-27-1103

39-27-1143

39-27-1163

39-27-1203

39-27-1263

39-27-1303

Plating NBGS2

39-27-1104

39-27-1144

39-27-1164

39-27-1204

39-27-1264

39-27-1304

Plating NBT2

39-28-5105

39-28-5145

39-28-5165

39-28-5205

39-28-5265

39-28-5305

Lead-free

Circuits

Order No.

Plating NBGS1

39-27-1343

39-27-1403

39-27-1503

39-27-1603

39-27-1643

Plating NBGS2

39-27-1344

39-27-1404

39-27-1504

39-27-1604

39-27-1644

Plating NBT2

39-28-5345

39-28-5405

39-28-5505

Lead-free

Yes

Plating NBGS1: 39m" (1mm) min. Nickel underplate. Contact area: 0.1mm min. Gold.

Solder area: 3mm min. Tin

Plating NBGS2: 39m" (1mm) min. Nickel underplate. Contact area: 0.76mm min. Gold.

Solder area: 3mm min. Tin

Plating NBT2: 20m" (0.5mm) min. Nickel underplate. Contact and solder area: 39m" (1mm) min. Tin

2.54mm (.100") Pitch

QF-50

™

Shrouded Header

5578

Right Angle

With Eject Levers

Features and Benefits

■

10 to 64 circuits

■

Tin plated on solder tail

■

Complies with industry standard DIN 41654

■

Polarized

■

Selective Gold plating options for contacts

■

Eject levers allow end-to-end stacking with or without

strain relief with no loss of board space

Reference Information

Packaging: Tray

Mates With: 5320

Designed In: Millimeters

Electrical

Voltage: 250V

Current: 1.0A

Contact Resistance: 20 milliohms max.

Dielectric Withstanding Voltage: 500V

Insulation Resistance: 1000 Megohms min.

Physical

Housing: Glass-filled PBTP

Contact: Brass

Operating Temperature: -40 to +105˚C

Circuits

Order No.

Plating NBGS17F

39-53-6108

39-53-6148

39-53-6168

39-53-6208

39-53-6268

39-53-6308

Plating NBGS2

39-53-6109

39-53-6149

39-53-6169

39-53-6209

39-53-6269

39-53-6309

Plating NBT2

39-28-5106

39-28-5146

39-28-5166

39-28-5206

39-28-5266

39-28-5306

Lead-free

Circuits

Order No.

Plating NBGS17F

39-53-6348

39-53-6408

39-53-6508

39-53-6608

39-53-6648

Plating NBGS2

39-53-6349

39-53-6409

39-53-6509

39-53-6609

39-53-6649

Plating NBT2

39-28-5346

39-28-5406

39-28-5506

Lead-free

Yes

Plating NBGS1: 39m" (1mm) min. Nickel underplate. Contact area: 0.1mm min. Gold.

Solder area: 3mm min. Tin.

Plating NBGS2: 39m" (1mm) min. Nickel underplate. Contact area: 0.76mm min. Gold.

Solder area: 3mm min. Tin.

Plating NBT2: 20m" (0.5mm) min. Nickel underplate. Contact and solder area: 39m" (1mm) min. Tin.

www.molex.com/product/ribbon/qfintro.html

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