Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
H57V1262GTRDESCRIPTION
The Hynix H57V1262GTR series is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the memory applica-
tions which require wide data I/O and high bandwidth. H57V1262GTR series is organized as 4banks of 2,097,152 x 16.
H57V1262GTR is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs
are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high
bandwidth. All input and output voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write
cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(se-
quential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate command or
can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined design is not re-
stricted by a '2N' rule)
FEATURES
•
•
•
•
Voltage: VDD, VDDQ 3.3V supply voltage
All device pins are compatible with LVTTL interface
54 Pin TSOPII (Lead Free Package)
All inputs and outputs referenced to positive edge of
system clock
Data mask function by UDQM, LDQM
•
•
•
•
Internal four banks operation
Auto refresh and self refresh
4096 Refresh cycles / 64ms
- Commercial Temperature (0
o
C to 70
o
C)
- Industrial Temperature (-40
o
C to 85
o
C)
Operating Temperature
•
•
•
•
Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
Programmable CAS Latency; 2, 3 Clocks
Burst Read Single Write operation
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This product is in compliance with the directive pertaining of RoHS.
ORDERING INFORMATION
Part No.
H57V1262GTR-50X
H57V1262GTR-60X
H57V1262GTR-70X
H57V1262GTR-75X
Note:
1. H57V1262GTR-XXC Series: Normal power, Commercial Temp.(0
o
C to 70
o
C)
2. H57V1262GTR-XXI Series: Normal power, Industrial Temp. (-40
o
C to 85
o
C)
3. H57V1262GTR-XXL Series: Low power, Commercial Temp.(0
o
C to 70
o
C)
4. H57V1262GTR-XXJ Series: Low power, Industrial Temp. (-40
o
C to 85
o
C)
Clock Frequency
200MHz
166MHz
143MHz
133MHz
Organization
Interface
Package
4Banks x 2Mbits x16
LVTTL
54 Pin TSOPII
Rev. 1.0 / Aug. 2009
2
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
PIN DESCRIPTION
SYMBOL
CLK
TYPE
Clock
DESCRIPTION
The system clock input. All other inputs are registered to the SDRAM
on the rising edge of CLK
Controls internal clock signal and when deactivated, the SDRAM will
be one of the states among power down, suspend or self refresh
Enables or disables all inputs except CLK, CKE, UDQM and LDQM
Selects bank to be activated during RAS activity
Selects bank to be read/written during CAS activity
Row Address: RA0 ~ RA11, Column Address: CA0 ~ CA8
Auto-precharge flag: A10
RAS, CAS and WE define the operation
Refer function truth table for details
Controls output buffers in read mode and masks input data in write
mode
Multiplexed data input / output pin
Power supply for internal circuits and input buffers
CKE
CS
BA0, BA1
Clock Enable
Chip Select
Bank Address
A0 ~ A11
Address
Row Address Strobe,
Column Address Strobe,
Write Enable
Data Input/Output Mask
Data Input/Output
Power Supply/Ground
RAS, CAS, WE
UDQM, LDQM
DQ0 ~ DQ15
VDD/VSS
VDDQ/VSSQ
NC
Data Output Power/Ground Power supply for output buffers
No Connection
No connection
Rev. 1.0 / Aug. 2009
4
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