EEPROM, 128KX8, 150ns, Parallel, CMOS, CDFP32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Micross |
| package instruction | DFP, FL32,.4 |
| Reach Compliance Code | unknown |
| Maximum access time | 150 ns |
| command user interface | NO |
| Data polling | YES |
| JESD-30 code | R-XDFP-F32 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 128KX8 |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL32,.4 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| page size | 128 words |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Maximum standby current | 0.00002 A |
| Maximum slew rate | 0.06 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| switch bit | NO |
| AS58C1001F-15 | AS58C1001SF-15 | AS58C1001SF-20 | |
|---|---|---|---|
| Description | EEPROM, 128KX8, 150ns, Parallel, CMOS, CDFP32 | EEPROM, 128KX8, 150ns, Parallel, CMOS, CDFP32 | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDFP32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DFP, FL32,.4 | DFP, FL32,.4 | DFP, FL32,.4 |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 150 ns | 150 ns | 200 ns |
| command user interface | NO | NO | NO |
| Data polling | YES | YES | YES |
| JESD-30 code | R-XDFP-F32 | R-XDFP-F32 | R-XDFP-F32 |
| JESD-609 code | e0 | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 |
| Number of terminals | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 128KX8 | 128KX8 | 128KX8 |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DFP | DFP |
| Encapsulate equivalent code | FL32,.4 | FL32,.4 | FL32,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | FLATPACK |
| page size | 128 words | 128 words | 128 words |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| ready/busy | YES | YES | YES |
| Maximum standby current | 0.00002 A | 0.00002 A | 0.00002 A |
| Maximum slew rate | 0.06 mA | 0.06 mA | 0.05 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | FLAT | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
| switch bit | NO | NO | NO |
| Is Samacsys | - | N | N |
| Base Number Matches | - | 1 | 1 |
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