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MT5C1005F-20L/IT

Description
Standard SRAM, 256KX4, 20ns, CMOS, CDFP32, CERAMIC, FLATPACK-32
Categorystorage    storage   
File Size169KB,13 Pages
ManufacturerMicross
Websitehttps://www.micross.com
Download Datasheet Parametric View All

MT5C1005F-20L/IT Overview

Standard SRAM, 256KX4, 20ns, CMOS, CDFP32, CERAMIC, FLATPACK-32

MT5C1005F-20L/IT Parametric

Parameter NameAttribute value
MakerMicross
Parts packaging codeDFP
package instructionCERAMIC, FLATPACK-32
Contacts32
Reach Compliance Codecompliant
Maximum access time20 ns
JESD-30 codeR-CDFP-F32
length20.828 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX4
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height3.175 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
width10.414 mm
SRAM
Austin Semiconductor, Inc.
256K x 4 SRAM
SRAM MEMORY ARRAY
AVAILABLE AS MILITARY
SPECIFICATIONS
•MIL-STD-883
MT5C1005
PIN ASSIGNMENT
(Top View)
28-Pin DIP (C)
(400 MIL)
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
CE\
OE\
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vcc
A6
A5
A4
A3
A2
A1
A0
NC
DQ4
DQ3
DQ2
DQ1
WE\
32-Pin LCC (EC)
32-Pin SOJ (DCJ)
A7
A8
A9
A12
A10
A11
A13
NC
A14
A15
A16
A17
NC
CE\
OE\
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Vcc
A6
A5
A2
A4
A3
A1
NC
NC
A0
NC
DQ4
DQ3
DQ2
DQ1
WE\
FEATURES
High Speed: 20, 25, 35, and 45
Battery Backup: 2V data retention
Low power standby
High-performance, low-power CMOS double-metal
process
• Single +5V (+10%) Power Supply
• Easy memory expansion with CE\ and OE\ options.
• All inputs and outputs are TTL compatible
A7
A8
A9
A12
A10
A11
A13
NC
A14
A15
A16
A17
NC
CE\
OE\
Vss
32-Pin Flat Pack (F)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Vcc
A6
A5
A2
A4
A3
A1
NC
NC
A0
NC
DQ4
DQ3
DQ2
DQ1
WE\
32-Pin LCC (ECW)
A9
A8
A7
NC
Vcc
A6
A5
4 3 2 1 31 32 30
A10
A11
A12
A13
A14
A15
A16
A17
CE\
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A2
A4
A3
A1
A0
NC
NC
NC
DQ4
OPTIONS
• Timing
20ns access
25ns access
35ns access
45ns access
55ns access
70ns access
MARKING
-20
-25
-35
-45
-55*
-70*
14 15 16 17 18 19 20
DQ3
DQ2
DQ1
WE\
Vss
OE\
NC
• Package(s)
Ceramic DIP (400 mil)
C
Ceramic Quad LCC
(contact factory)
ECW
Ceramic LCC
EC
Ceramic Flatpack
F
Ceramic SOJ
DCJ
• Operating Temperature Ranges
Industrial (-40
o
C to +85
o
C)
IT
o
o
Military (-55 C to +125 C)
XT
• 2V data retention/low power
L
No. 109
No. 206
No. 207
No. 303
No. 501
GENERAL DESCRIPTION
The Austin Semiconductor SRAM family employs
high-speed, low power CMOS designs fabricated using double-
layer metal, double-layer polysilicon technology.
For flexibility in high-speed memory applications, ASI
offers chip enable (CE\) and output enable (OE\) capability.
These enhancements can place the outputs in High-Z for addi-
tional flexibility in system design. Writing to these devices is
accomplished when write enable (WE\) and CE\ inputs are both
LOW. Reading is accomplished when WE\ remains HIGH while
CE\ and OE\ go LOW. The devices offer a reduced power
standby mode when disabled. This allows system designs to
achieve low standby power requirements.
All devices operation from a single +5V power supply
and all inputs and outputs are fully TTL compatible.
*Electrical characteristics identical to those provided for the
45ns access devices.
For more products and information
please visit our web site at
www.austinsemiconductor.com
MT5C1005
Rev. 3.1 1/01
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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