EEWORLDEEWORLDEEWORLD

Part Number

Search

NAND01GR4A3DN1F

Description
64MX16 FLASH 1.8V PROM, 15000ns, PDSO48, 12 X 20 MM, TSOP-48
Categorystorage    storage   
File Size150KB,5 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance  
Download Datasheet Parametric View All

NAND01GR4A3DN1F Overview

64MX16 FLASH 1.8V PROM, 15000ns, PDSO48, 12 X 20 MM, TSOP-48

NAND01GR4A3DN1F Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSTMicroelectronics
Parts packaging codeTSOP
package instructionTSOP1,
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time15000 ns
JESD-30 codeR-PDSO-G48
JESD-609 codee3
length18.4 mm
memory density1073741824 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count67108864 words
character code64000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width12 mm
NAND FLASH
528 Byte, 264 Word Page Family
128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16)
1.8V, 3V Supply Flash Memories
DATA BRIEFING
FEATURES SUMMARY
s
HIGH DENSITY NAND FLASH MEMORIES
– Up to 1 Gbit memory array
– Up to 32Mbit spare area
– Cost effective solutions for mass storage ap-
plications
s
Figure 1. Packages
NAND INTERFACE
– x8 or x16 bus width
– Multiplexed Address/ Data
– Pinout compatibility for all densities
TSOP48
12 x 20 mm
s
SUPPLY VOLTAGE
– 1.8V device: V
CC
= 1.65 to 1.95V
– 3.0V device: V
CC
= 2.7 to 3.6V
FBGA
s
PAGE SIZE
– x8 device: (512 + 16 spare) Bytes
– x16 device: (256 + 8 spare) Words
VFBGA63 8.5x15x1 mm
TFBGA63 8.5x15x1.2 mm
VFBGA63 9x11x1 mm
s
BLOCK SIZE
– x8 device: (16K + 512 spare) Bytes
– x16 device: (8K + 256 spare) Words
s
AUTOMATIC PAGE 0 READ AT POWER-UP
OPTION
– Boot from NAND support
– Automatic Memory Download
s
PAGE READ / PROGRAM
– Random access: 12µs (max)
– Sequential access: 50ns (min)
– Page program time: 200µs (typ)
s
s
SERIAL NUMBER OPTION
HARDWARE DATA PROTECTION
– Program/Erase locked during Power transi-
tions
s
COPY BACK PROGRAM MODE
– Fast page copy without external buffering
CACHE PROGRAM MODE
– Internal Cache Register to improve the pro-
gram throughput
s
s
DATA INTEGRITY
– 100,000 Program/Erase cycles
– 10 years Data Retention
s
FAST BLOCK ERASE
– Block erase time: 2ms (Typ)
STATUS REGISTER
ELECTRONIC SIGNATURE
CHIP ENABLE ‘DON’T CARE’ OPTION
– Simple interface with microcontroller
s
DEVELOPMENT TOOLS
– Error Correction Code software and hard-
ware models
– Bad Blocks Management and Wear Leveling
algorithms
– PC Demo board with simulation software
– File System OS Native reference software
– Hardware simulation models
s
s
s
August 2003
For further information please contact the STMicroelectronics distributor nearest to you.
1/5
hfss18 version 3D image setting problem
How to display the color scale next to the 3D image after superimposing the model?...
耩聴聴 TI Technology Forum
Doubts about the "edge detector" of the capture channel of the STM32 timer
How does the "edge detector" of the capture channel of the STM32 timer detect and identify edges? For example, if I want to detect the rising edge of a signal, what is the rising amplitude of my signa...
huixianfxt stm32/stm8
[BearPi-HM Nano, play Hongmeng "touch and pay"] -7-"pseudo touch and pay" LED control
[i=s]This post was last edited by sun63312 on 2021-8-16 13:30[/i]HarmonyOS " pseudo touch " LED control implementation 1. Introduction: It has been a long time since I started working on this project,...
sun63312 ARM Technology
Experts please come in, RIL_DeleteMsg usage problem!
HRESULT RIL_DeleteMsg( HRIL hRil, DWORD dwIndex //Specifies the index of the message to be deleted ); How should dwIndex in the above function parameters be used?...
cokiy Embedded System
When connecting a PC and a charger via USB, how can the device distinguish whether it is connected to the PC or the charger?
The specific problem is this: When the device is connected to the PC and charger via USB, the device side can determine the plugging and unplugging of the USB, but after the connection, the device sid...
ljpronaldo Embedded System
Let's see how much this kind of experience is worth when changing jobs.
Education: Postgraduate Work experience: I started working in the second year of graduate school. I have worked on microcontrollers, FPGA, and PCB drawings, but they were not very sophisticated. I hav...
converter Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1809  673  295  1602  1748  37  14  6  33  36 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号