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PC123P82J00F

Description
Transistor Output Optocoupler, 1-Element, 5000V Isolation, ROHS COMPLIANT, PLASTIC, SMT, DIP-4
CategoryLED optoelectronic/LED    photoelectric   
File Size282KB,16 Pages
ManufacturerSHARP
Websitehttp://sharp-world.com/products/device/
Environmental Compliance
Download Datasheet Parametric View All

PC123P82J00F Overview

Transistor Output Optocoupler, 1-Element, 5000V Isolation, ROHS COMPLIANT, PLASTIC, SMT, DIP-4

PC123P82J00F Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSHARP
package instructionROHS COMPLIANT, PLASTIC, SMT, DIP-4
Reach Compliance Codeunknown
Other featuresUL RECOGNIZED
Coll-Emtr Bkdn Voltage-Min70 V
ConfigurationSINGLE
Nominal current transfer ratio200%
Maximum dark power100 nA
Maximum forward current0.05 A
Maximum insulation voltage5000 V
Number of components1
Maximum operating temperature100 °C
Minimum operating temperature-30 °C
Optoelectronic device typesTRANSISTOR OUTPUT OPTOCOUPLER
PC123N02J00F Series
PC123N02J00F
Series
DIP 4pin Reinforced Insulation Type
Photocoupler
Description
PC123N02J00F Series
contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5kV.
CTR is 50% to 400% at input current of 5mA
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
le No. E64380 (as model No.
PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950
le No. 7409, (as model No.
PC123)
3. Approved by SEMKO, EN60065, EN60950, (as mod-
el No.
PC123)
4. Approved by DEMKO, EN60065, EN60950, (as mod-
el No.
PC123)
5. Approved by NEMKO, EN60065, EN60950, (as mod-
el No.
PC123)
6. Approved by FIMKO, EN60065, EN60950, (as model
No.
PC123)
7. Recognized by CSA
le No. CA95323 (as model No.
PC123)
8. Approved by VDE, DIN EN60747-5-2(
) (as an op-
tion),
le No. 40008087 (as model No.
PC123)
9. Package resin : UL
ammability grade (94V - 0)
(
) DIN EN60747-5-2 : successor standard of DIN VDE0884.
Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Current transfer ratio (CTR : MIN. 50% at I
F
=5
mA,
V
CE
=5V)
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(V
iso
(rms) : 5kV)
8. Lead-free and RoHS directive compliant
Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
4. Over voltage detection
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A09401EN
Date Sep. 1. 2006
© SHARP Corporation

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