EEWORLDEEWORLDEEWORLD

Part Number

Search

HY27US08121A-FPIP

Description
Flash, 64MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63
Categorystorage    storage   
File Size414KB,49 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Environmental Compliance
Download Datasheet Parametric View All

HY27US08121A-FPIP Overview

Flash, 64MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63

HY27US08121A-FPIP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSK Hynix
Parts packaging codeBGA
package instructionVFBGA, BGA63,10X12,32
Contacts63
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time30 ns
command user interfaceYES
Data pollingNO
JESD-30 codeR-PBGA-B63
JESD-609 codee1
length11 mm
memory density536870912 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size4K
Number of terminals63
word count67108864 words
character code64000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64MX8
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA63,10X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size512 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Programming voltage3.3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1 mm
Department size16K
Maximum standby current0.00005 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
switch bitNO
typeSLC NAND TYPE
width9 mm
HY27US(08/16)121A Series
HY27SS(08/16)121A Series
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
Document Title
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash Memory
Revision History
Revision
No.
0.0
Initial Draft.
History
Draft Date
Sep. 2004
Remark
Preliminary
0.1
1) Correct part number ( change mode)
- 2A -> 1A (sequential row read : disable -> enable)
2) Correct Table.5 & Table 12
- Correct Command Set
- correct AC timing characteristics (tWP : 40 -> 25ns, tWH : 20 ->15ns)
3) Correct Summary description & page.7
- The cache feature is deleted in summary description.
Oct. 22. 2004
- Note.3 is deleted. (page.7)
4) Add System interface using CE don’t care (page. 38)
5) Change TSOP1, WSOP1,FBGA package dimension & figures.
- Change TSOP1, WSOP1, FBGA package mechanical data
- Change TSOP1, WSOP package figures
6) Correct TSOP1, WSOP1 Pin configuration
- 38th NC pin has been changed Lockpre (figure 2,3)
7) Add Bad block Management
1) LOCKPRE is changed to PRE
- Texts, Table and figures are changed.
2) Change Command set
- Read A,B are changed to Read1.
- Read C is changed to Read2.
3) Change AC, DC characterics
Preliminary
0.2
- tRB, tCRY, tCEH and tOH are added.
4) Correct Program time (max)
- before : 700us
- after
: 500us
5) Edit figures
- Address names are changed.
6) Change FBGA Package Dimension
- FD1 : 1.70(before) -> 0.90(after)
Mar. 08. 2005 Preliminary
Rev 1.3 / Jun. 2006
1
Specific discussion on the differences between Chinese LED and foreign LED packaging: one is the difference in packaging equipment and testing - original
The main LED packaging production equipment includes die bonders, wire bonders, glue sealers, spectrometers, glue dispensers, smart ovens and other equipment. Five or six years ago, LED automatic pack...
探路者 LED Zone
NCP1050 series single chip switching power supply
Principle and application of NCP1050 series single-chip switching power supply...
frozenviolet Power technology
Communication interface
[b][size=18px]Can USB to serial port be used to do serial port communication experiments between PC and MCU? How to connect the hardware? . Why is there no received data displayed when opening the ser...
菜鸟12号 Microcontroller MCU
CC3200 PWM and ADC issues
This is the first time I use TI's CC3200 WIFI module. I encountered a problem during use. Please help me. 1. CC3200SDK1.3.0 example/PWM routine, the default code works fine.After modifying the PWM fre...
zhangyuebin Wireless Connectivity
Problems with using variable length parameters in Eboot
To transplant part of the BootLoader code under ADS to Eboot, ADS uses variable-length parameters as follows: #includevoid DM_Printf(char *fmt, ...) { char buffer[PRINTF_BUFFER_SIZE + 1]; va_list ap; ...
swaty Embedded System
Original Electronics Competition Handwriting Drawing Board After a day of painstaking research, I have a little harvest to share with you
After a day, I finally got some ideas. I would like to provide some suggestions for those who may still have no ideas. If you think it is good, please give it a thumbs up. It is also my motivation to ...
aibing Electronics Design Contest

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2020  2138  2676  1722  493  41  44  54  35  10 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号