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PEB2080-N

Description
Digital SLIC, Basic, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28
CategoryWireless rf/communication    Telecom circuit   
File Size3MB,73 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric View All

PEB2080-N Overview

Digital SLIC, Basic, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28

PEB2080-N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQLCC
package instructionPLASTIC, LCC-28
Contacts28
Reach Compliance Codeunknow
data rate144 Mbps
ISDN access rateBASIC
JESD-30 codeR-PQCC-J28
JESD-609 codee0
length14.05 mm
Number of functions1
Number of terminals28
Maximum operating temperature70 °C
Minimum operating temperature
Minimum output high voltage2.4 V
Maximum output low current0.007 A
Maximum output low voltage0.45 V
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC28,.4X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
reference pointS/T
Maximum seat height3.8 mm
standardCCITT I.430
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesDIGITAL SLIC
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width8.95 mm
Base Number Matches1
General Information
Contents
1
1.1
1.2
2
2.1
2.2
2.3
2.4
2.5
3
3.1
3.2
3.3
4
5
6
7
Page
Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
System Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Functional Description
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Functions and Device Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Individual Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Additional Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Description
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking, Reset and Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control of Layer 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15
15
16
20
27
36
38
38
38
41
Electrical Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Package Outlines
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Information on Literature.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Semiconductor Group - Addresses
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
IOM
®
, IOM
®
-1, IOM
®
-2, ISAC
®
-P, ISAC
®
-S, EPIC
®
are registered trademarks of Siemens AG
Semiconductor Group
3

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Index Files: 2515  2428  1757  69  2074  51  49  36  2  42 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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