Contents
Page
Page
Introduction
...............................
........................
3
4
9
11
26
35
55
79
82
Package Information
Summary of Types
in Alphanumerical Order
.....................
208
Quality Assurance
Mobile Communication ICs
....................
..........
209
215
219
232
................
GSM/PCN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF-Building Blocks . . . . . . . . . . . . . . . . . . . . . . . . .
Microelectronics Training Center
Information on Literature
..................
........
Digital Terminal ICs
Analog Line Cards
.......................
..............
.........................
Semiconductor Group – Addresses
Digital Exchange System ICs
Digital Line Cards . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Primary Rate Interface (PRI) ICs
Switching, Attenuation
and Conferencing Family ICs
Communication Network ICs
Development Systems
for Information Technology
. . . . . . . . . . . 125
. . . . . . . . . . . . . . 141
. . . . . . . . . . . . . . . 157
171
Asynchronous Transfer Mode (ATM) ICs
. . . . .
. . . . . . . . . . . . . . . . 185
IOM
®
, IOM
®
-1, IOM
®
-2, SICOFI
®
, SICOFI
®
-2, SICOFI
®
-4, SICOFI
®
-4
µ
C, SLICOFI
®
, ARCOFI
®
, ARCOFI
®
-BA, ARCOFI
®
-SP, EPIC
®
-1,
EPIC
®
-S, ELIC
®
, IPAT
®
-2, ITAC
®
, ISAC
®
-S, ISAC
®
-S TE, ISAC
®
-P, ISAC
®
-P TE, IDEC
®
, SICAT
®
, OCTAT
®
-P, QUAT
®
-S are registered
trademarks of Siemens AG.
MUSAC
™
-A, FALC
™
54, IWE
™
, SARE
™
, UTPT
™
, ASM
™
, ASP
™
, are trademarks of Siemens AG.
Purchase of Siemens
I
2
C components conveys a license under the Philips’
I
2
C patent to use the components in the
I
2
C-system provided the
system conforms to the
I
2
C specifications defined by Philips. Copyright Philips 1983.
Siemens Aktiengesellschaft
1
Introduction
Siemens is THE allround-supplier of Communication ICs.
Siemens offers ICs for Digital Exchange Systems, Digital
Terminals, Data Transmission Analog and Networks, Mobile
Communications and Analog Telephone Sets.
Communication ICs from Siemens – that means innovative
and wide ranging problem solving. Siemens Semiconductor
Division has integrated system know-how verified by wide
field experience and excellent chip technology.
A short look to the product segment ISDN, demonstrates:
For the development of ISDN equipment from terminals to
PBX and public switching systems Siemens offers the
broadest range of ISDN chips available on the merchant
market. Siemens is the worldwide market leader for ISDN
ICs, due to their high level of functionality resulting in greatly
simplified system design.
In addition, the industry standard IOM-2 interface supports
flexible system architecture with compatible devices.
Siemens represents technology leadership, offers powerful
software and application tools.
Siemens is your partner for Communication ICs:
• Innovative complete system solutions
• Highly optimized devices
• Reliable volume production lines and advanced
technology innovation
• Technical support all over the world
• Long term experience and skilled expert teams
• Long term customer relationships
• Excellent quality
• Basic success factors for further innovations
– Experienced R+D team
– Device macros
– Design tools
– Technology
Due to the fact that Siemens offers a broad range of
Communication ICs the overview of the spectrum is
presented in this brochure.
If you have further questions or if you need application
support, please contact your local Siemens office.
Addresses you will find in this brochure.
Call Siemens – your partner for Communication ICs!
Siemens Aktiengesellschaft
3
Quality Assurance
1 Quality Assurance
The high quality and reliability of integrated circuits from
Siemens are the result of carefully managed design and
production which is systematically checked and controlled at
each stage.
The procedures are subject to a quality assurance system;
full details are given in the brochure “Quality Assurance
lntegrated Circuits”.
Figure 1 and 2
show the most important stages of the QA
system. Quality assurance (QA) departments, independent
of production and development, are responsible for the
selected measures, acceptance procedures and information
feedback loops. Operating QA departments have state-of-
the-art test and measuring equipment at their disposal, work
according to approved methods of statistical quality control,
and are provided with facilities for accelerated life and
environmental tests used for both qualification and routine
monitoring tests.
The latest methods and equipment for preparation and
analysis are employed to achieve continuity of quality and
reliability.
Specifications, Product Plan, Quality Requirements
Design Rules Check
Suitability of Technology
Design Phase
Estimate Reliability
Planning of Qualification
Release of Qualification
Program
Engineering Samples
Concept Release
Design, Optimization, (Redesign)
Specification met, Process frozen, Production Start
Preliminary Documentation
(Fab Instructions)
First Results of
Qualification Tests
Clearance for delivering
limited Quantities
Pre-Series Release
Production Phase
Production Reproducible
Lot Release, Reliability Monitoring
under QA Surveillance
Pre-Series Samples
and-Deliveries
Final Documentation (Data
Sheet, Fab Instruction)
Complete Qualification
Results
Clearance for unlimited
Deliveries
Series-Samples
and-Deliveries
ITA05872
Series Release
Series Production
Figure 1
Siemens Aktiengesellschaft
4
Quality Assurance
Quality Capability Audits
Suppliers
Parts, Materials
(Physical, Electrical)
Incoming
Inspection
SPC
Wafer Fabrication
Electrical/Optical Chip Testing
Testing Process Parameter
Visual Wafer Inspection
Process Audits
Physical Parameters Dim-
ensions, Geometries visual
recognizeable Failures
Wafer Lot
Clearence
SPC
Visual Chip Test
Die Attach
Wire Bond Strength
Process Audits
Die Seperation Assembly,
Wire Bonding, Vis. Examination
before Encapsulation
Visual Inspection
of bonded Chips
Assembly
Lot Clearance
SPC
Sealing/Molding
Cavity Packages; Hermeticity
Test Final Surface of Leads
Product Marking
SPC
Screening (e.g. Burn-IN)
(If Specified)
Failure Analysis
of defective Parts
Process Audits
Plastic Packages;
X-ray Test
Vis. Inspection Lead Surface
Process Audits
Final (Outgoing) Product Test
(Electrical/Mechanical)
Packing for Shipment
100% Performed
Outgoing Inspection
Electrical Function,
Parameters Mechanical Data
Product
Lot Clearance
Sample Tests
Performed by Quality
Assurance Department
Surveillance of Process
Steps and Equipment by SPC
ITA05873
Periodical
Reliability Monitoring
Figure 2
Product ready for Shipment
Stock, Shipping
Siemens Aktiengesellschaft
5
2 Conformance
Each integrated circuit is subjected to a final test at the end of
the production process. These tests are carried out by
computer-controlled, automatic test systems as hundreds of
thousands of operating conditions as well as a large number
of static and dynamic parameters have to be considered.
Moreover, the test systems are extremely reliable and
reproducible. The quality assurance department carries out a
final check in the form of a lot-by-lot sampling inspection to
additionally ensure the minimum percent defectives to
ensure statistically that the PDA of released lots is less than
the AQL agreed. Sampling inspection is performed in
accordance with the inspection plans of DIN 40080, as well
as of the identical MIL-STD-105 or IEC 410.
3.3 Reliability monitoring
The general course of IC failure rate versus time is shown by
a so-called “bathtub” curve.The failure rate has its peak
during the first few operating hours (early failure period). After
the early failure period has ended, the “constant” failure rate
period starts during which the failures may occur at an
approximately uniform rate. This period ends with a repeated
rise of the curve during the wear-out failure period. For ICs,
however, the latter period usually lies far beyond the service
life specified for the individual equipment. Reliability tests for
ICs are usually destructive examinations. They are,
therefore, carried out with samples. Most failure mechanisms
can be accelerated by means of higher temperatures. Due to
the temperature dependence of the failure mechanisms, it is
possible to simulate future operational behavior within a short
time by applying high temperatures; this is called life test. The
acceleration factor
F
for the life test can be obtained from
Arrhenius’s equation
E
A
1 1
- -
F
=
exp
-----
----- – -----
-
k
T
1
T
2
where
T
2
is the temperature at which the life test is
performed,
T
1
is the assumed operating temperature and
k
is Boltzmann’s constant.
Important for factor
F
is the activation energy
E
A
. It lies
between 0.3 and 1.3 eV and differs considerably for
individual failure mechanisms.
For all Siemens ICs the reliability data from life tests is
converted to an operating temperature of
T
A
= 55
°
C,
assuming an average activation energy of 0.5 eV. The
acceleration factor for life tests at 125
°
C is thus 22,
compared with operational behavior. This method considers
also failure mechanisms with low activation energy, i.e. which
are only slightly accelerated by the temperature effect.
Various reliability tests are periodically performed with IC
types that are representative of a certain production line this
is described in the brochure “Quality Assurance Integrated
Circuits”. Such tests are e.g. humidity test at 85
°
C and 85 %
relative humidity, pressure cooker test, as well as life tests up
to 1000 hours and more. Test results are available in the form
of summary reports.
3 Reliabilitiy
3.1 Measures taken during development
The reliability of ICs is already considerably influenced at the
development stage. Siemens has, therefore, fixed certain
design standards for the development of circuits and layout,
e.g. specifying minimum width and spacing of conductive
layers on a chip, dimensions and electrical parameters of
protective circuits for electrostatic charge, etc. An
examination with the aid of carefully arranged programs
operated on large-scale computers guarantees the
immediate identification and elimination of unintentional
violations of these design standards.
3.2 In-process control during production
The manufacturing of integrated circuits comprises several
hundred production steps. As each step is to be executed
with utmost accuracy, the in-process control is of outstanding
importance. Some processes require more than a hundred
different test measurements. The tests have been arranged
such that the individual process steps can be reproduced
continuously.
The decreasing failure rates reflect the never ending effort in
this direction; in the course of the years they have been
reduced considerably despite an immense increase in IC
complexity.
Siemens Aktiengesellschaft
6
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