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SKIIP1092GAR170-474CTV

Description
Half Bridge Based Peripheral Driver, 1250A
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size107KB,3 Pages
ManufacturerSEMIKRON
Websitehttp://www.semikron.com
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SKIIP1092GAR170-474CTV Overview

Half Bridge Based Peripheral Driver, 1250A

SKIIP1092GAR170-474CTV Parametric

Parameter NameAttribute value
MakerSEMIKRON
package instruction,
Reach Compliance Codeunknown
ECCN codeEAR99
Built-in protectionTRANSIENT; OVER CURRENT; THERMAL
Interface integrated circuit typeHALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 codeR-XXMA-X
Number of functions1
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Output current flow directionSOURCE AND SINK
Nominal output peak current1250 A
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
Nominal supply voltage15 V
surface mountNO
Temperature levelOTHER
Terminal formUNSPECIFIED
Terminal locationUNSPECIFIED

SKIIP1092GAR170-474CTV Preview

SKiiP 1092 GB 170 - 474 CTV
Absolute Maximum Ratings
Symbol
V
isol 4)
T
op
,T
stg
Conditions
AC, 1min
Operating / stor. temperature
1)
Values
4000
-25...+85
1700
1200
1000
-40...+150
1000
2000
8640
373
18
30
7,0
75
Units
V
°C
V
V
A
°C
A
A
A
kAs
2
V
V
kHz
kV/µs
IGBT and Inverse Diode
V
CES
V
CC 5)
Operating DC link voltage
I
C
IGBT
3)
T
j
IGBT + Diode
I
F
Diode
I
FM
Diode, t
p
< 1 ms
I
FSM
Diode, T
j
= 150 °C, 10ms; sin
2
I t (Diode) Diode, T
j
= 150 °C, 10ms
Driver
V
S1
Stabilized Power Supply
V
S2
Non-stabilized Power Supply
f
smax
Switching frequency
dV/dt
Primary to secondary side
SKiiPPACK
®
SK integrated intelligent
Power PACK
halfbridge
SKiiP
7,9)
1092 GB 170 - 474 CTV
Preliminary Data
Case S4
Characteristics
Symbol
IGBT
11)
V
(BR)CES
I
CES
V
TO
r
T
V
Cesat
V
Cesat
E
on
+ E
off
C
CHC
L
CE
Conditions
1)
min.
≥V
CES
typ.
60
3,2
2
max.
4
1,77
4,1
5,1
3,85
845/130
1
2,60
2,90
120
0,90
1,3
0,023
0,063
33
Units
V
mA
mA
V
mΩ
V
V
mJ
nF
nH
V
V
mJ
V
mΩ
K/W
K/W
K/KW
mA
mA
µs
A
A
°C
V
Driver without supply
V
GE
= 0,
T
j
= 25 °C
V
CE
= V
CES
T
j
= 125 °C
T
j
= 125 °C
T
j
= 125 °C
I
C
= 800A,
T
j
= 125 °C
I
C
= 800A,
T
j
= 25 °C
V
CC
=900/1200V, I
C
=1000A
T
j
= 125 °C
per Phase, AC side
Top, Bottom
T
j
= 125 °C
T
j
= 25 °C
T
j
= 125 °C
Inverse Diode
2)
V
F
= V
EC
I
F
= 800A;
V
F
= V
EC
I
F
= 800A;
E
on
+ E
off
I
F
= 1000A;
V
TO
T
j
= 125 °C
r
T
T
j
= 125 °C
Features
Short circuit protection, due to
evaluation of current sensor
signals
Isolated power supply
Low thermal impedance
Optimal thermal management
with integrated heatsink
Pressure contact technology
with increased power cycling
capability, compact design
Low stray inductance
High power, small losses
Over-temperature protection
1)
2)
3)
4)
Thermal Characteristics
R
thjs10)
per IGBT
10)
R
thjs
per Diode
6,10)
R
thsa
P16 heatsink; see case S4
Driver
I
S1
Supply current 15V-supply
I
S2
Supply current 24V-supply
t
interlock-driver
Interlock-time
SKiiPPACK protection
I
TRIPSC
Short circuit protection
I
TRIPLG
Ground fault protection
T
TRIP
Over-temp. protection
9)
U
DCTRIP
U
DC
-protection
Mechanical Data
M1
DC terminals, SI Units
M2
AC terminals, SI Units
B 7
62
5)
6)
7)
290+490*f
s
/f
smax
+1,3*I
AC
/A
220+370*f
s
/f
smax
+1,0*I
AC
/A
3,0
1250
-
115
1225
4
8
0898
6
10
8)
9)
10)
Nm
Nm
T
heatsink
= 25 °C, unless
otherwise specified
CAL = Controlled Axial Lifetime
Technology (soft and fast)
without driver
Driver input to DC link /
AC output to DC link / AC
output to heatsink
with Semikron-DC link (low
inductance)
other heatsinks on request
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
AC connection busbars must be
connected by the user; copper
busbars available on request
options available for driver:
U - DC link voltage sense
F – Fiber optic connector
s
” referenced to temperature
sensor
©by
SEMIKRON
PIN-array - halfbridge driver SKiiPPACK 4-fold type “GB”
X1:
Pin
1
2
3
signal
shield
BOT IN
4)
ERROR OUT
1)
remark
connected to GND, when shielded cable is used
positive 15V CMOS logic; 10 kΩ impedance,
don´t connect when using fiber optic
LOW = NO ERROR; open Collector Output;
max. 30 V / 15 mA
don´t connect when using fiber optic,
propagation delay 1
µs
min. pulsewidth error-memory-reset 8
µs
positive 15V CMOS logic; 10 kΩ impedance
don´t connect when using fiber optic
LOW = NO ERROR =
ϑ
DCB
< 115 + 5°C
open collector Output; max. 30 V / 15 mA
„low“ output voltage < 0,6 V
„high“ output voltage max. 30 V
24 V
DC
(20 - 30 V)
don´t supply with 24 V, when using + 15 V
DCIN
supply voltage monitoring threshold 19,5 V
15 V
DC
+ 4 %
don´t supply with 15 V, when using + 24 V
DCIN
supply voltage monitoring threshold 13 V
GND for power supply and
GND for digital signals
4
5
TOP IN
4)
Overtemp. OUT
1)
6
7
8
9
10
11
12
+ 24 V
DC
IN
+ 24 V
DC
IN
+ 15 V
DC
IN
+ 15 V
DC
IN
GND
GND
Temp. analog OUT or U
DC
when using option “U”
U
DC
analog OUT
2)
actual DC-link voltage, 9 V refer to U
DCmax
max. output current 5 mA; overvoltage trip level 9 V
GND aux
3)
I analog OUT
GND for analog signals
current actual value, 8,0 V refer to I
C
@ 25 °C
overcurrent trip level 10 V
125 % I
C
@ 25 °C
current value > 0
SKiiP is source
current value < 0
SKiiP is sink
13
14
X10: halfbridge 1 (HB1) OUT
Pin Signal
1
2
8
11
12
13
16
17
Collector TOP (HB1)
Gate TOP (HB1)
Emitter TOP (HB1)
Collector BOT (HB1)
Gate BOT (HB1)
Emitter BOT (HB1)
X11: halfbridge 2 (HB2) OUT
Pin Signal
1
2
8
11
12
13
16
17
Temp.-Sensor (HB2)1
Temp.-Sensor (HB2)2
Collector TOP (HB2)
Gate TOP (HB2)
Emitter TOP (HB2)
Collector BOT (HB2)
Gate BOT (HB2)
Emitter BOT (HB2)
X12: halfbridge 3 (HB3) OUT
Pin Signal
1
2
8
11
12
13
16
17
Collector TOP (HB3)
Gate TOP (HB3)
Emitter TOP (HB3)
Collector BOT (HB3)
Gate BOT (HB3)
Emitter BOT (HB3)
1)
X13: halfbridge 4 (HB4) OUT
Pin Signal
1
2
8
11
12
13
16
17
Collector TOP (HB4)
Gate TOP (HB4)
Emitter TOP (HB4)
Collector BOT (HB4)
Gate BOT (HB4)
Emitter BOT (HB4)
type “GAL”
as type “GB” except
- PIN X1-4: connect this pin to GND
- TOP switch does not exist
type “GAR”
as type “GB” except
- PIN X1-2: connect this pin to GND
- BOTTOM switch does not exist
Open collector output, external pull
up resistor necessary
2)
When using option “U” the analog
temperature signal is not available
3)
GND aux = reference for analog
output signals
4)
„high“ (min) 11,2 V
„low“ (max) 5,4 V
B 7 – 12
0898
© by SEMIKRON
Case S4
SKiiPPACK 4 - GB
Weight without heatsink: 3,54 kg
P16:
8,46 kg
SKiiPPACK 4 - GB with F-option
© by SEMIKRON
0898
B7–4

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SKIIP1092GAR170-474CTV SKIIP1092GAR170-474CTVF SKIIP1092GAR170-474CTVU
Description Half Bridge Based Peripheral Driver, 1250A Half Bridge Based Peripheral Driver, 1250A Half Bridge Based Peripheral Driver, 1250A
Maker SEMIKRON SEMIKRON SEMIKRON
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
Built-in protection TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL
Interface integrated circuit type HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 code R-XXMA-X R-XXMA-X R-XXMA-X
Number of functions 1 1 1
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -25 °C -25 °C -25 °C
Output current flow direction SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK
Nominal output peak current 1250 A 1250 A 1250 A
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Certification status Not Qualified Not Qualified Not Qualified
Nominal supply voltage 15 V 15 V 15 V
surface mount NO NO NO
Temperature level OTHER OTHER OTHER
Terminal form UNSPECIFIED UNSPECIFIED UNSPECIFIED
Terminal location UNSPECIFIED UNSPECIFIED UNSPECIFIED
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