Bulletin I0509J rev. D 03/07
SC070.....5. Series
SCHOTTKY DIE 70 x 92 mils
40 (157)
Wafer flat alligned with
side b of the die
a
c
0.35 ± 0.01
(14 ± 0.4)
C
A
D
b
Ø 125 (492)
Ø
NOTES:
1. ALL DIMENSIONS ARE SHOWN IN
MILLIMETERS (MILS).
2. CONTROLLING DIMENSION: (MILS).
d
NOT TO SCALE
3. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
4. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 + 0, - 0.005
(2 + 0, - 0.2)
5. DIMENSIONS AND TOLERANCES
Device
#
SC070
R
015x5x
SC070
S
020x5x
SC070
S
030x5x
SC070
S
045x5x
SC070
S
060x5x
SC070
H
045x5x
SC070
H
100x5x
SC070
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
A
B
C
D
diameter
n.a. contact factory
n.a. contact factory
1.78 + 0, - 0.01 2.34 + 0, - 0.01 1.63 + 0, - 0.01 2.18 + 0, - 0.01
(70 + 0, - 0.4) (92 + 0, - 0.4) (64 + 0, - 0.4) (86 + 0, - 0.4)
1.78 + 0, - 0.01 2.34 + 0, - 0.01 1.63 + 0, - 0.01 2.18 + 0, - 0.01
(70 + 0, - 0.4) (92 + 0, - 0.4) (64 + 0, - 0.4) (86 + 0, - 0.4)
1.78 + 0, - 0.01 2.34 + 0, - 0.01 1.63 + 0, - 0.01 2.18 + 0, - 0.01
(70 + 0, - 0.4) (92 + 0, - 0.4) (64 + 0, - 0.4) (86 + 0, - 0.4)
1.78 + 0, - 0.01 2.34 + 0, - 0.01 1.63 + 0, - 0.01 2.18 + 0, - 0.01
(70 + 0, - 0.4) (92 + 0, - 0.4) (64 + 0, - 0.4) (86 + 0, - 0.4)
1.78 + 0, - 0.01 2.34 + 0, - 0.01 1.63 + 0, - 0.01 2.18 + 0, - 0.01
(70 + 0, - 0.4) (92 + 0, - 0.4) (64 + 0, - 0.4) (86 + 0, - 0.4)
1.78 + 0, - 0.01 2.34 + 0, - 0.01 1.63 + 0, - 0.01 2.18 + 0, - 0.01
(70 + 0, - 0.4) (92 + 0, - 0.4) (64 + 0, - 0.4) (86 + 0, - 0.4)
0.7 ± 0.15
30 ± 6
0.7 ± 0.15
30 ± 6
0.7 ± 0.15
30 ± 6
0.7 ± 0.15
30 ± 6
0.7 ± 0.15
30 ± 6
0.7 ± 0.15
30 ± 6
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Document Number: 93863
SC070.....5.
Bulletin I0509J rev. D 03/07
Electrical Characteristics
Device
#
SC070
R
015x5x
SC070
S
020x5x
SC070
S
030x5x
SC070
S
045x5x
SC070
S
060x5x
SC070
H
045x5x
SC070
H
100x5x
SC070
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
90
70
15
12
20
2
Typ. I
R
@ 25°C
(μA)
Typ. I
R
@ 125°C
(mA)
Max. V
F
@ I
F
@ 25°C
(V)
Package
Style
n.a. contact factory
n.a. contact factory
38
32
10
4
2.5
1.5
0.55 @ 12A
0.70 @ 15A
0.61 @ 6A
0.70 @ 15A
0.95 @ 12A
1.1 @ 10A
D-Pak (TO-252)
TO-220)
D-Pak (TO-252)
TO-220
D-Pak (TO-252)
TO-220
Mechanical Data
Device
#
SC070xxxx
A
5x
SC070xxxx
S
5x
Bondable
Solderable
--
Ti 2 kÅ
Metal Thickness
Front Metal
Al (1% Si) 30 kÅ
Ni 1 kÅ
--
Ag 35 kÅ
Cr 1 kÅ
Cr 1 kÅ
Metal Thickness
Back Metal
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
#
SC070xxxxx5
B
SC070xxxxx5
R
SC070xxxxx5
P
SC070xxxxx5
F
Description
Minimum Order Quantity
Die in Sale Package
2500
n.a
2500
2500
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
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Document Number: 93863
SC070.....5.
Bulletin I0509J rev. D 03/07
Data and specifications subject to change without notice.
This product has been designed for Industrial Level.
Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7309
Visit us at www.irf.com for sales contact information. 03/07
Document Number: 93863
www.vishay.com
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