K7A161800A-FC20 datasheet, PDF

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K7A161800A-FC20: DescriptionCache SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165; Categorystorage storage; File Size700KB，28 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K7A161800A-FC20 Overview

Cache SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165

K7A161800A-FC20 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	LBGA, BGA165,11X15,40
Contacts	165
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	3.1 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	200 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B165
JESD-609 code	e0
length	15 mm
memory density	18874368 bit
Memory IC Type	CACHE SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum standby current	0.06 A
Minimum standby current	3.14 V
Maximum slew rate	0.4 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13 mm

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K7A163600A

K7A163200A

K7A161800A

Document Title

512Kx36/x32 & 1Mx18 Synchronous SRAM

512Kx36/x32 & 1Mx18-Bit Synchronous Pipelined Burst SRAM

Revision History

Rev. No.

0.0

0.1

0.2

0.3

History

Initial draft

1. Add JTAG Scan Order

1. Add x32 org and industrial temperature .

2. Add 165FBGA package

1. Speed Bin Merge

From K7A1636(32/18)09A to K7A1636(32/18)00A

2. AC parameter change

tOH(min)/tHZC(min) from 0.8 to 1.5 at -25

tOH(min)/tHZC(min) from 1.0 to 1.5 at -22

tOH(min)/tHZC(min) from 1.0 to 1.5 at -20

1. Final spec release

1. Release Icc.

part #

-25

-22

-20

-16

-14

From

440

400

370

340

280

470

430

400

350

290

Draft Date

Feb. 23. 2001

May. 10. 2001

Aug. 31. 2001

Dec. 26. 2001

Remark

Preliminary

1.0

2.0

May. 10. 2002

May. 22. 2002

Final

-1-

May 2002

Rev 2.0

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