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K7A163600A-QI14

Description
Cache SRAM, 512KX36, 4ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100
Categorystorage    storage   
File Size700KB,28 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K7A163600A-QI14 Overview

Cache SRAM, 512KX36, 4ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100

K7A163600A-QI14 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeQFP
package instructionLQFP, QFP100,.63SQ,20
Contacts100
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time4 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)138 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density18874368 bit
Memory IC TypeCACHE SRAM
memory width36
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63SQ,20
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.06 A
Minimum standby current3.14 V
Maximum slew rate0.29 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
K7A163600A
K7A163200A
K7A161800A
Document Title
512Kx36/x32 & 1Mx18 Synchronous SRAM
512Kx36/x32 & 1Mx18-Bit Synchronous Pipelined Burst SRAM
Revision History
Rev. No.
0.0
0.1
0.2
0.3
History
Initial draft
1. Add JTAG Scan Order
1. Add x32 org and industrial temperature .
2. Add 165FBGA package
1. Speed Bin Merge
From K7A1636(32/18)09A to K7A1636(32/18)00A
2. AC parameter change
tOH(min)/tHZC(min) from 0.8 to 1.5 at -25
tOH(min)/tHZC(min) from 1.0 to 1.5 at -22
tOH(min)/tHZC(min) from 1.0 to 1.5 at -20
1. Final spec release
1. Release Icc.
part #
-25
-22
-20
-16
-14
From
440
400
370
340
280
To
470
430
400
350
290
Draft Date
Feb. 23. 2001
May. 10. 2001
Aug. 31. 2001
Dec. 26. 2001
Remark
Preliminary
Preliminary
Preliminary
Preliminary
1.0
2.0
May. 10. 2002
May. 22. 2002
Final
Final
-1-
May 2002
Rev 2.0
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