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K7N163645A-HI22

Description
ZBT SRAM, 512KX36, 2.8ns, CMOS, PBGA119, BGA-119
Categorystorage    storage   
File Size631KB,28 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K7N163645A-HI22 Overview

ZBT SRAM, 512KX36, 2.8ns, CMOS, PBGA119, BGA-119

K7N163645A-HI22 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time2.8 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B119
length22 mm
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals119
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX36
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width14 mm
K7N163645A
K7N163245A
K7N161845A
Document Title
512Kx36/32 & 1Mx18 Pipelined NtRAM
TM
512Kx36/32 & 1Mx18-Bit Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
0.3
History
1. Initial document.
1. Add JTAG Scan Order
1. Add x32 org and industrial temperature .
2. Add 165FBGA package
1. Speed bin merge.
From K7N1636(32/18)49A to K7N1636(32/18)45A.
2. AC parameter change.
tOH(min)/tLZC(min) from 0.8 to 1.5 at -25
tOH(min)/tLZC(min) from 1.0 to 1.5 at -22
tOH(min)/tLZC(min) from 1.0 to 1.5 at -20
Final spec release
Release Icc on page 14.
part #
-25
-22
-20
-16
-13
From
440
400
370
340
280
To
470
430
400
350
290
Draft Date
Feb. 23. 2001
May. 10. 2001
Aug. 30. 2001
Dec. 26. 2001
Remark
Preliminary
Preliminary
Preliminary
Preliminary
1.0
2.0
May. 10. 2002
May. 22. 2002
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
May 2002
Rev 2.0

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