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KM23C4100AG-20

Description
MASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40
Categorystorage    storage   
File Size88KB,4 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KM23C4100AG-20 Overview

MASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40

KM23C4100AG-20 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeSOIC
package instructionSOP, SOP40,.56
Contacts40
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time200 ns
Spare memory width16
JESD-30 codeR-PDSO-G40
JESD-609 codee0
length26.2 mm
memory density4194304 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals40
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP40,.56
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height2.8 mm
Maximum standby current0.00005 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.67 mm

KM23C4100AG-20 Related Products

KM23C4100AG-20 KM23C4100AG-25 KM23C4100AG-15
Description MASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40 MASK ROM, 512KX8, 250ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40 MASK ROM, 512KX8, 150ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker SAMSUNG SAMSUNG SAMSUNG
Parts packaging code SOIC SOIC SOIC
package instruction SOP, SOP40,.56 SOP, SOP40,.56 SOP, SOP40,.56
Contacts 40 40 40
Reach Compliance Code compliant compliant compliant
ECCN code EAR99 EAR99 EAR99
Maximum access time 200 ns 250 ns 150 ns
Spare memory width 16 16 16
JESD-30 code R-PDSO-G40 R-PDSO-G40 R-PDSO-G40
JESD-609 code e0 e0 e0
length 26.2 mm 26.2 mm 26.2 mm
memory density 4194304 bit 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM MASK ROM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 40 40 40
word count 524288 words 524288 words 524288 words
character code 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 512KX8 512KX8 512KX8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP
Encapsulate equivalent code SOP40,.56 SOP40,.56 SOP40,.56
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 2.8 mm 2.8 mm 2.8 mm
Maximum standby current 0.00005 A 0.00005 A 0.00005 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10.67 mm 10.67 mm 10.67 mm
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