SIP Sockets
Table of Models
SIP Sockets
Molded and Peel-A-Way Insulators
Description:
Peel-A-Way
®
Strips (KSS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
®
.005 Typ.
(.13)
Description:
Molded Snap Strips (RSS, RLSS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.030 Typ.
(.76)
.095 Typ.
(2.41)
.095 Typ.
(2.41)
Head Above
Plastic
Head Flush
with Plastic
.095 Typ.
(2.41)
Features:
• Available in three body types:
Peel-A-Way
®
Removable Terminal
Carriers, molded Solid Strips, and
molded Snap Strips [breakable at
.100/(2.54mm)].
• Tapered entry for ease of
insertion.
• Multi-finger contacts for reliability.
• Closed bottom sleeve for 100%
anti-wicking of solder.
• Custom configurations available.
Description:
Molded Solid Strips (RNB, RLNB)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.030 Typ.
(.76)
.095 Typ.
(2.41)
Head Above
Plastic
Head Flush
with Plastic
RSS/RLSS replaces HSS/HLSS and SS/LSS. RNB/RLNB replaces HNB/HLNB and NB/LNB.
Options
Tape Seal - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments.
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers.
• Spray flux without contaminating contact area.
• Material - Silicone Backed Polyimide Film, -74°C to 260°C (-100°F
to 500°F) Intermittent to 371°C (700°F)
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Dimensional Information
Molded
Body Types
.100 Typ.
(2.54)
.100
(2.54)
A
.095
A Dimension = number of pins X .100/(2.54)
.100
(2.54)
Peel-A-Way
®
Body Types
.100 Typ.
(2.54)
A
A Dimension = [number of pins X .100/(2.54)] + .200/(5.08)
How To Order
KSS
Body Type
RoHS Compliant:
032
-85
M
G
Contact Plating
RoHS Compliant:
KSS - Peel-A-Way
RSS - Molded Snap (head above)
RLSS - Molded Snap (head flush)
RNB - Molded Solid (head above)
RLNB - Molded Solid (head flush)
Number of Pins
KSS: 2-100 pos.
RSS/RLSS: 20, 30 or 32 pos.
RNB/RLNB: 3-20, 30 or 32 pos.
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
SIP Sockets
Type -51
.072 Dia.
(1.83)
Standard Quick-Turn Terminals
.072 Dia.
(1.83)
Additional standard and custom terminals available.
See Terminals section or consult factory.
Type -49
Not for use with RSS or RNB.
.072 Dia.
(1.83)
.120
(3.05)
AY
V
D
E
LI
Type -04
Type -01
Molded only
.072 Dia.
(1.83)
.130
(3.30)
.095
(2.41)
.021 Hole
(.53) Dia.
.145
(3.68)
.165
(4.19)
.110
(2.79)
.020 Dia.
(.51)
.028 Dia.
(.71)
.110
(2.79)
.095
(2.41)
.028 Dia.
(.71)
.125
(3.18)
.020 Dia.
(.51)
Type -33
Peel-A-Way only
®
Type -85
Peel-A-Way only
®
Type -176
Peel-A-Way only
®
Type -210
Peel-A-Way
®
only
.072 Dia.
(1.83)
.058 Dia.
(1.47)
.058 Dia.
(1.47)
.058 Dia.
(1.47)
ER
Y
Molded and Peel-A-Way Insulators
QU
®
K-TU
IC
SIP Sockets
3-5
RN
3-5
D
Available Online:
.015
(.38)
.165
(4.19)
.031
(.79)
.155
(3.94)
.031
(.79)
• RoHS Qualification Test Report
.155
(3.94)
.155
(3.95)
• CAD Drawings
.125
(3.18)
.020 Dia.
(.51)
.038 Dia.
(.97)
.034 Dia.
(.86)
.034 Dia.
(.86)
Solder Preform Terminals
Tin/Lead: Type -150
Lead-free: Type -811
.072 Dia.
(1.83)
Tin/Lead: Type -151
Lead-free: Type -812
.072 Dia.
(1.83)
.130
(3.30)
Tin/Lead: Type -111
Lead-free: Type -810
Peel-A-Way
®
only
.058 Dia.
(1.47)
.165
(4.19)
Solder
Preform
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
Solder
Preform
.031
(.79)
.155
(3.94)
.110
(2.79)
.020 Dia.
(.51)
.038 Dia.
(.97)
Intrusive Reflow Application
Solder Preform Terminals
• Combines the labor of socket loading and solder
application into one operation.
• Eliminates the use of solder paste and screening
operation.
• Eliminates solder bridges and/or solder shorts
due to excess solder.
• Ensures a reliable solder joint with controlled
solder volume.
• Ideal for surface mount and mixed technology
applications.
• For custom solder preform terminal applications
consult factory.
BEFORE REFLOW
AFTER REFLOW
SOLDER
PREFORM
PLATED THRU
HOLE (PTH)
PCB
PCB
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
Microcontroller MCU
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