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KBY00U00VA-B4500

Description
Memory Circuit, 64MX16, CMOS, PBGA137, 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-137
Categorystorage    storage   
File Size2MB,92 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

KBY00U00VA-B4500 Overview

Memory Circuit, 64MX16, CMOS, PBGA137, 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-137

KBY00U00VA-B4500 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeBGA
package instructionTFBGA,
Contacts137
Reach Compliance Codeunknown
Other featuresSRAM IS ORGANISED AS 64M X 32 PLUS 64M X 32
JESD-30 codeR-PBGA-B137
length13 mm
memory density1073741824 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals137
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize64MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width10.5 mm

KBY00U00VA-B4500 Preview

Rev. 1.0, Jul. 2010
KBY00U00VA-B450
MCP Specification
8Gb DDP (512M x16) NAND Flash
+ 4Gb (64M x32 + 64M x32) 2/CS,2CKE DDP Mobile DDR SDRAM
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2010 Samsung Electronics Co., Ltd. All rights reserved.
-1-
KBY00U00VA-B450
datasheet
History
Draft Date
Jun. 10, 2010
Rev. 1.0
MCP Memory
Revision History
Revision No.
0.0
Remark
Preliminay
Editor
H.J.Min
Initial issue.
- 8Gb DDP NAND Flash V-die_Ver 0.0
- 4Gb DDP Mobile DDR C-die_Ver 0.2
<Common>
- Finalized
<NAND Flash>_Ver 1.1
Revision 1.0v
1. Chapter 2.2 Recommended Operating Conditions revised.
Revision 1.1v
1. Chapter 2.8 Read / Program / Erase Characteristics Parameter
reviesed.
<Mobile DDR SDRAM>_Ver 1.0
- Corrected errata.
- Revised DC characteristics.
1.0
Jul. 28, 2010
Final
J.S.Ahn
-2-
KBY00U00VA-B450
datasheet
Rev. 1.0
MCP Memory
1. FEATURES
<Common>
Operating Temperature : -25°C ~ 85°C
Package : 137 FBGA Type - 10.5mmx13mmx1.2mmt, 0.8mm pitch
<NAND Flash>
Voltage Supply
- 1.8V Device : 1.7V ~ 1.95V
Organization
- Memory Cell Array :
(256M + 8M) x 16bit for 4Gb
(512M + 16M) x 16bit for 8Gb DDP
- Data Register : (2K + 64) x 16bit
Automatic Program and Erase
- Page Program : (2K + 64)Word
- Block Erase : (128K + 4K)Word
Page Read Operation
- Page Size : (2K + 64)Word
- Random Read : 60μs(Max.) (TBD)
- Serial Access : 42ns(Min.)
Fast Write Cycle Time
- Page Program time : 420μs(Typ.) (TBD)
- Block Erase Time : 3ms(Typ.) (TBD)
Command/Address/Data Multiplexed I/O Port
Hardware Data Protection
- Program/Erase Lockout During Power Transitions
Reliable CMOS Floating-Gate Technology
-Endurance : TBD Program/Erase Cycles
with 4bit/256Word ECC for x16
Command Driven Operation
Unique ID for Copyright Protection
<Mobile DDR>
• VDD/VDDQ = 1.8V/1.8V
• Double-data-rate architecture; two data transfers per clock cycle.
• Bidirectional data strobe (DQS).
• Four banks operation.
• Differential clock inputs (CK and CK).
• MRS cycle with address key programs.
- CAS Latency (3)
- Burst Length (2, 4, 8, 16)
- Burst Type (Sequential & Interleave)
• EMRS cycle with address key programs.
- Partial Array Self Refresh (Full, 1/2, 1/4 Array)
- Output Driver Strength Control (Full, 1/2, 1/4, 1/8, 3/4, 3/8, 5/8, 7/8)
• Internal Temperature Compensated Self Refresh.
• All inputs except data & DM are sampled at the positive going edge of the
system clock (CK).
• Data I/O transactions on both edges of data strobe, DM for masking.
• Edge aligned data output, center aligned data input.
• No DLL; CK to DQS is not synchronized.
• DM for write masking only.
• Auto refresh duty cycle.
- 7.8us
• Clock stop capability
• 2/CS, 2CKE
Operating Frequency
DDR400
Speed @CL3
1)
NOTE :
1) CAS Latency
200MHz
Address configuration
Organization
64Mx32
64Mx32
/CS
CS0
CS1
CKE
CKE0
CKE1
Bank
BA0,BA1
BA0,BA1
Row
A0 - A13
A0 - A13
Column
A0 - A9
A0 - A9
- DM is internally loaded to match DQ and DQS identically.
-3-
KBY00U00VA-B450
datasheet
Rev. 1.0
MCP Memory
2. GENERAL DESCRIPTION
The KBY00U00VA is a Multi Chip Package Memory which combines 8Gbit DDP Nand Flash Memory(organized with two pieces of 4Gbit Nand Flash
Memory) and 4Gbit DDR synchronous high data rate Dynamic RAM(organized with two pieces of 2Gbit Mobile DDR SDRAM).
NAND cell provides the most cost-effective solution for the solid state application market. A program operation can be performed in typical 420μs(TBD) on
the (2K+64)Word page and an erase operation can be performed in typical 3ms(TBD) on a (128K+4K)Word block. Data in the data register can be read
out at 42ns cycle time per Word. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller
automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-
intensive systems can take advantage of the device′s extended reliability of TBD program/erase cycles by providing ECC(Error Correcting Code) with real
time mapping-out algorithm. The device is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable
applications requiring non-volatility.
In 4G bit DDP Mobile DDR, Synchronous design make a device controlled precisely with the use of system clock. Range of operating frequencies, pro-
grammable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory sys-
tem applications.
The KBY00U00VA is suitable for use in data memory of mobile communication system to reduce not only mount area but also power consumption. This
device is available in 137-ball FBGA Type.
-4-
KBY00U00VA-B450
datasheet
2
DNU
CKE1d
A4d
A5d
A8d
A11d
/RASd
/CASd
/CS0d
BA1d
A2d
VSSd
IO1n
IO8n
DNU
3
-
/REn
/WPn
A7d
CKE0d
/CS1d
DQ15d
DQ20d
BA0d
A10d
A3d
A13d
IO2n
IO9n
-
4
-
CLEn
ALEn
A9d
DQ18d
DQ17d
DQ16d
DQ21d
DQ14d
A0d
DQ0d
NC
IO10n
IO11n
-
5
-
VCCn
VSSn
DQ25d
DQS3d
DQ19d
DQS1d
DQ13d
DQ11d
DQ7d
DQ1d
IO3n
VCCn
IO12n
-
6
-
/CEn
R/Bn
DQ27d
DQ22d
DQ24d
DM1d
DQ12d
DQ10d
DQ8d
DQ2d
IO5n
IO6n
VSSn
-
7
-
/WEn
DQ31d
DQ29d
DM3d
DQ23d
DQ9d
DQS2d
DQS0d
DQ6d
DQ3d
IO14n
IO13n
IO4n
-
8
-
VDDd
DQ30d
DQ28d
DQ26d
DM2d
CKd
/CKd
DM0d
DQ4d
DQ5d
IO7n
IO15n
VDDd
-
Rev. 1.0
MCP Memory
3. PIN CONFIGURATION
-
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
-
NC
VSSd
VDDd
A6d
A12d
NC
VDDd
VSSd
/WEd
A1d
VDDd
IO0n
NC
DNU
9
DNU
VSSd
VDDQd
VSSQd
VDDQd
VSSQd
VDDQd
VSSd
VSSQd
VDDQd
VDDQd
VSSQd
VDDQd
VSSd
DNU
10
DNU
NC
VSSQd
VDDQd
VSSQd
VDDQd
VSSQd
VDDd
VDDQd
VSSQd
VSSQd
VDDQd
VSSQd
NC
DNU
137 FBGA: Top View (Ball Down)
NAND
Mobile DRAM
Power
Ground
NC/DNU
-5-

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