Buffer, CMOS, CDIP16
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUFFER |
| MaximumI(ol) | 0.008 A |
| Humidity sensitivity level | 3 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 21 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |





| KS74HCTLS4050J | KS54HCTLS4050J | |
|---|---|---|
| Description | Buffer, CMOS, CDIP16 | Buffer, CMOS, CDIP16 |
| Is it lead-free? | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | SAMSUNG | SAMSUNG |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | compliant | compliant |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF |
| Logic integrated circuit type | BUFFER | BUFFER |
| MaximumI(ol) | 0.008 A | 0.008 A |
| Humidity sensitivity level | 3 | 3 |
| Number of terminals | 16 | 16 |
| Maximum operating temperature | 85 °C | 125 °C |
| Minimum operating temperature | -40 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 |
| power supply | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 21 ns | 26 ns |
| Certification status | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 |