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KM48RC2H-A60

Description
Rambus DRAM, 2MX8, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36
Categorystorage    storage   
File Size2MB,34 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KM48RC2H-A60 Overview

Rambus DRAM, 2MX8, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36

KM48RC2H-A60 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeSOIC
package instructionLSSOP, SSOP72,.5
Contacts36
Reach Compliance Codeunknown
ECCN codeEAR99
access modeBLOCK ORIENTED PROTOCOL
Maximum clock frequency (fCLK)600 MHz
I/O typeCOMMON
JESD-30 codeR-PDSO-G36
JESD-609 codee0
length25.1 mm
memory density16777216 bit
Memory IC TypeRAMBUS DRAM
memory width8
Number of functions1
Number of ports1
Number of terminals36
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
organize2MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLSSOP
Encapsulate equivalent codeSSOP72,.5
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum standby current0.001 A
Maximum slew rate0.5 mA
Maximum supply voltage (Vsup)3.45 V
Minimum supply voltage (Vsup)3.15 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

KM48RC2H-A60 Related Products

KM48RC2H-A60 KM48RC2H-A66 KM49RC2H-A60 KM49RC2H-A66
Description Rambus DRAM, 2MX8, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36 Rambus DRAM, 2MX8, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36 Rambus DRAM, 2MX9, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36 Rambus DRAM, 2MX9, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker SAMSUNG SAMSUNG SAMSUNG SAMSUNG
Parts packaging code SOIC SOIC SOIC SOIC
package instruction LSSOP, SSOP72,.5 LSSOP, SSOP72,.5 LSSOP, SSOP72,.5 LSSOP, SSOP72,.5
Contacts 36 36 36 36
Reach Compliance Code unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
access mode BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL
Maximum clock frequency (fCLK) 600 MHz 667 MHz 600 MHz 667 MHz
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G36 R-PDSO-G36 R-PDSO-G36 R-PDSO-G36
JESD-609 code e0 e0 e0 e0
length 25.1 mm 25.1 mm 25.1 mm 25.1 mm
memory density 16777216 bit 16777216 bit 18874368 bit 18874368 bit
Memory IC Type RAMBUS DRAM RAMBUS DRAM RAMBUS DRAM RAMBUS DRAM
memory width 8 8 9 9
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 36 36 36 36
word count 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
organize 2MX8 2MX8 2MX9 2MX9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSSOP LSSOP LSSOP LSSOP
Encapsulate equivalent code SSOP72,.5 SSOP72,.5 SSOP72,.5 SSOP72,.5
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.7 mm 1.7 mm 1.7 mm 1.7 mm
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.5 mA 0.5 mA 0.5 mA 0.5 mA
Maximum supply voltage (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V
Minimum supply voltage (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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