|
KM48RC2H-A60 |
KM48RC2H-A66 |
KM49RC2H-A60 |
KM49RC2H-A66 |
| Description |
Rambus DRAM, 2MX8, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36 |
Rambus DRAM, 2MX8, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36 |
Rambus DRAM, 2MX9, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36 |
Rambus DRAM, 2MX9, CMOS, PDSO36, PLASTIC, HORIZONTAL SMT-36 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
SAMSUNG |
SAMSUNG |
SAMSUNG |
SAMSUNG |
| Parts packaging code |
SOIC |
SOIC |
SOIC |
SOIC |
| package instruction |
LSSOP, SSOP72,.5 |
LSSOP, SSOP72,.5 |
LSSOP, SSOP72,.5 |
LSSOP, SSOP72,.5 |
| Contacts |
36 |
36 |
36 |
36 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| access mode |
BLOCK ORIENTED PROTOCOL |
BLOCK ORIENTED PROTOCOL |
BLOCK ORIENTED PROTOCOL |
BLOCK ORIENTED PROTOCOL |
| Maximum clock frequency (fCLK) |
600 MHz |
667 MHz |
600 MHz |
667 MHz |
| I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
| JESD-30 code |
R-PDSO-G36 |
R-PDSO-G36 |
R-PDSO-G36 |
R-PDSO-G36 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| length |
25.1 mm |
25.1 mm |
25.1 mm |
25.1 mm |
| memory density |
16777216 bit |
16777216 bit |
18874368 bit |
18874368 bit |
| Memory IC Type |
RAMBUS DRAM |
RAMBUS DRAM |
RAMBUS DRAM |
RAMBUS DRAM |
| memory width |
8 |
8 |
9 |
9 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of ports |
1 |
1 |
1 |
1 |
| Number of terminals |
36 |
36 |
36 |
36 |
| word count |
2097152 words |
2097152 words |
2097152 words |
2097152 words |
| character code |
2000000 |
2000000 |
2000000 |
2000000 |
| Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
| organize |
2MX8 |
2MX8 |
2MX9 |
2MX9 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LSSOP |
LSSOP |
LSSOP |
LSSOP |
| Encapsulate equivalent code |
SSOP72,.5 |
SSOP72,.5 |
SSOP72,.5 |
SSOP72,.5 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.7 mm |
1.7 mm |
1.7 mm |
1.7 mm |
| Maximum standby current |
0.001 A |
0.001 A |
0.001 A |
0.001 A |
| Maximum slew rate |
0.5 mA |
0.5 mA |
0.5 mA |
0.5 mA |
| Maximum supply voltage (Vsup) |
3.45 V |
3.45 V |
3.45 V |
3.45 V |
| Minimum supply voltage (Vsup) |
3.15 V |
3.15 V |
3.15 V |
3.15 V |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |